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VD0534A Aluminium Antimony Pellet Evaporation Material (AlSb)

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Introduction

Aluminium Antimony (AlSb) is a III–V compound semiconductor material widely used in thin-film deposition for infrared optoelectronics and advanced electronic devices. As an evaporation material, AlSb pellets offer stable evaporation behavior, good compositional uniformity, and compatibility with high-vacuum thermal and electron-beam evaporation systems. Their pelletized form ensures controlled feeding, reduced spitting, and improved film reproducibility in research and industrial coating processes.

Detailed Description

Aluminium Antimony Pellet Evaporation Material (AlSb) is synthesized from high-purity aluminum and antimony under controlled conditions to ensure precise stoichiometry and phase consistency. The pellets are engineered with optimized density and surface quality to support smooth evaporation and minimize material loss during deposition.

Compared with irregular chunks or powders, pelletized AlSb provides:

  • More uniform evaporation rates, supporting consistent film thickness.

  • Improved compositional control, critical for semiconductor and infrared applications.

  • Cleaner handling and loading, reducing contamination risks in vacuum chambers.

AlSb exhibits a narrow bandgap and favorable electron mobility, making it particularly suitable for infrared detectors, heterostructures, and compound semiconductor research. The material can be supplied with tailored pellet sizes to match different crucible or hearth designs.

Applications

Aluminium Antimony evaporation pellets are commonly used in:

  • Infrared detector and imaging device fabrication

  • Compound semiconductor thin films

  • Epitaxial buffer layers and heterostructures

  • Research and development of III–V semiconductor materials

  • Optoelectronic and microelectronic experimental coatings

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionAlSb (stoichiometric)Ensures stable electrical and optical properties
Purity99.9% – 99.99%Reduces defects and contamination in thin films
Pellet Size1 – 6 mm (customizable)Matches evaporation sources and crucibles
FormSolid pelletsEnables controlled evaporation and easy handling
Evaporation MethodThermal / E-beamCompatible with common PVD systems

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Aluminium Antimony (AlSb)Narrow bandgap, good lattice matchingInfrared detectors, III–V research
Gallium Antimonide (GaSb)Higher hole mobilityHigh-performance IR devices
Indium Antimonide (InSb)Extremely narrow bandgapLong-wavelength IR sensing

FAQ

QuestionAnswer
Can AlSb pellets be customized in size?Yes, pellet diameter and weight can be tailored to specific evaporation sources.
Which evaporation methods are suitable?AlSb pellets are compatible with both thermal and electron-beam evaporation.
How is compositional uniformity ensured?Controlled synthesis and strict quality inspection ensure consistent stoichiometry.
Is the material suitable for R&D use?Yes, it is widely used in laboratory research and pilot-scale production.

Packaging

Our Aluminium Antimony Pellet Evaporation Materials are carefully tagged and labeled for clear identification and traceability. Each batch is vacuum-sealed and packed with protective materials to prevent oxidation, contamination, or mechanical damage during storage and transportation, ensuring the pellets arrive in optimal condition.

Conclusion

Aluminium Antimony Pellet Evaporation Material (AlSb) provides a reliable solution for precise thin-film deposition in infrared and compound semiconductor applications. With controlled purity, customizable pellet sizes, and consistent evaporation performance, it supports both advanced research and specialized industrial processes.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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