Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

VD0534A Aluminium Antimony Pellet Evaporation Material (AlSb)

MSDS File
Material TypeAluminium Antimony
SymbolAlSb
Melting Point (°C)1080
Theoretical Density (g/cc)4.3
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

Aluminium Antimony Pellet Evaporation Material

TFM offers high-purity Aluminium Antimony Pellet Evaporation Material, a critical compound used in thin-film deposition, optoelectronics, and semiconductor research. Known for its exceptional electronic properties, this material is commonly used in high-performance devices such as infrared sensors, photodetectors, and advanced semiconductors.

Key Features and Advantages

  • High Purity (99.99% – 99.999%) – Guarantees superior performance in thin-film deposition and electronic applications.

  • Excellent Electrical Properties – Provides enhanced conductivity for high-performance electronic and optoelectronic devices.

  • Optimized for Thin-Film Deposition – Compatible with thermal evaporation and E-beam evaporation techniques.

  • Stable & Uniform Coating – Delivers consistent, uniform thin films, essential for high-efficiency devices.

  • Customizable Composition – The Al/Sb ratio can be tailored to meet specific application requirements, enhancing performance.

Applications

  • Semiconductor Devices – Ideal for advanced transistors, diodes, and integrated circuits.

  • Infrared Detectors & Sensors – Applied in thermal imaging, infrared detection, and optical sensors.

  • Photodetectors & Photovoltaic Devices – Used in solar cells, light sensors, and optical communication systems.

  • Thin-Film Transistors – Suitable for transparent electronics, displays, and flexible electronics.

Industry Impact

TFM’s Aluminium Antimony Pellet Evaporation Material is a high-performance material critical to cutting-edge semiconductor and optoelectronic technologies. With high purity, superior electrical properties, and stable deposition characteristics, it is an ideal choice for innovative applications in infrared sensing, photovoltaics, and advanced semiconductor devices.

Reviews

There are no reviews yet.

Be the first to review “VD0534A Aluminium Antimony Pellet Evaporation Material (AlSb)”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

Shopping Cart
Scroll to Top