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Aluminium Telluride Evaporation Materials

VD0856 Aluminium Telluride Evaporation Materials, Al2Te3

Material Type：Aluminium Telluride
Symbol：Al2Te3
Color/Appearance：Dark grey or black
Purity: 99.9% ~ 99.99%
Shape: Granules or tablets

At TFM, we specialize in producing and supplying high-purity aluminum telluride evaporation materials, alongside a broad selection of other evaporation materials. Our products are available in both powder and granule forms to meet diverse needs. Additionally, we offer customized solutions tailored to your specific requirements.

MSDS File
Aluminium Telluride Evaporation Materials Overview

Aluminium telluride evaporation materials, with the chemical formula Al₂Te₃, are crucial for achieving high-quality deposited films. TFM specializes in producing these telluride ceramic materials with purity levels up to 99.9995%. Our stringent quality assurance processes ensure the reliability of our products.

Product Specifications

Compound FormulaAl2Te3
Molecular Weight436.76
AppearanceDark grey or black
Melting Point900 °C
Boiling PointN/A
Density4.5 g/cm3

Applications

Aluminium telluride evaporation materials are widely used in various film applications, including anti-reflection coatings, hard films, glass films, and multilayer films.

Packaging Details

Our aluminium telluride evaporation materials are securely packaged in plastic vacuum bags to protect them during storage and transportation. Each package includes a Certificate of Analysis (COA) for the raw material to ensure quality.

Why Choose TFM?

TFM is renowned for producing high-purity aluminium telluride evaporation materials suitable for semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) applications. Our team’s expertise in engineering, manufacturing, and analysis ensures we provide industry-leading products. Contact us today for more information or to make an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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