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Aluminum Al Rotary Sputtering Target

Aluminum (Al) Rotary Sputtering Target

Introduction

Aluminum (Al) Rotary Sputtering Targets are widely used in large-area thin-film deposition systems where high throughput, excellent film uniformity, and long target lifetime are required. As one of the most mature and reliable sputtering materials, aluminum plays a critical role in semiconductor metallization, display technologies, optical coatings, and functional barrier layers. The rotary target design further enhances process stability and material utilization, making it especially suitable for industrial-scale continuous coating lines.

Detailed Description

Aluminum rotary sputtering targets are manufactured from high-purity aluminum ingots that undergo vacuum melting, controlled casting, and precision machining. The cylindrical geometry enables uniform erosion over the entire target surface as it rotates during sputtering, significantly improving target utilization compared with planar targets and reducing downtime caused by frequent target replacement.

The rotary structure also improves thermal management by distributing heat more evenly across the target body, allowing higher power densities and more stable long-term operation. Aluminum’s excellent electrical conductivity ensures smooth plasma ignition and stable sputtering behavior under DC magnetron conditions.

Depending on application requirements, aluminum rotary targets can be supplied as monolithic tubes or bonded structures with optimized backing materials to enhance mechanical strength and heat dissipation. Tight control over grain structure and impurity levels ensures consistent deposition rates and uniform film properties across wide substrates.

Applications

Aluminum rotary sputtering targets are commonly used in:

  • Semiconductor manufacturing: Interconnects, electrodes, and metallization layers

  • Flat panel displays: TFT-LCD and OLED backplane conductive films

  • Architectural and automotive glass: Reflective and functional metal layers

  • Optical coatings: Reflective films and multilayer stacks

  • Barrier and protective coatings: Corrosion-resistant and diffusion barrier layers

  • Large-area coating systems: Roll-to-roll and in-line vacuum coaters

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialAluminum (Al)Determines conductivity and reflectivity
Purity99.99% – 99.999%Improves film uniformity and reliability
Outer Diameter120 – 200 mm (custom)Matches rotary magnetron design
LengthUp to 3000 mm (custom)Supports large-area coating
StructureMonolithic or bondedEnhances strength and heat transfer
Sputtering ModeDC magnetronStable high-rate deposition
Surface FinishPrecision machinedEnsures uniform erosion

Comparison with Planar Aluminum Targets

Target TypeKey AdvantageTypical Use
Al Rotary TargetHigh utilization, long lifetimeLarge-area industrial coating
Planar Al TargetSimple structure, lower costSmall to medium chambers
Al Alloy Rotary TargetTailored propertiesSpecialized functional films

FAQ

QuestionAnswer
Why choose a rotary aluminum target instead of planar?Rotary targets offer higher material utilization, longer lifetime, and better uniformity.
Is DC sputtering suitable for aluminum?Yes, aluminum is highly conductive and ideal for DC magnetron sputtering.
Can dimensions be customized?Yes, outer diameter, length, purity, and structure can be tailored.
What industries use rotary Al targets most?Semiconductor, display, architectural glass, and large-area coatings.

Packaging

Our Aluminum (Al) Rotary Sputtering Targets are individually protected and clearly labeled to ensure traceability and quality control. Each target is carefully packed with reinforced supports and moisture-resistant materials to prevent deformation or surface damage during storage and transportation.

Conclusion

Aluminum (Al) Rotary Sputtering Targets combine the proven performance of aluminum with the efficiency of rotary magnetron technology. Offering high deposition rates, excellent film uniformity, and extended service life, they are an ideal solution for demanding large-area and high-volume thin-film coating applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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