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Aluminum Al Rotary Sputtering Target

Aluminum (Al) Rotary Sputtering Target

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Introduction

TFM offers high-quality Aluminum Al rotary sputtering targets, designed for thin-film deposition in a wide range of advanced applications, including semiconductors, coatings, and electronics. Aluminum Al targets are known for their excellent electrical conductivity, high reflectivity, and corrosion resistance, making them ideal for producing thin films in electronics and optical coatings.

The rotary sputtering target design ensures efficient and uniform deposition of Aluminum Al films, which are commonly used in electronic devices, reflective coatings, and thermal management applications. Aluminum Al films provide low resistance, making them highly suitable for conductive layers in semiconductor devices, capacitors, and interconnects. Additionally, Aluminum oxide (Al₂O₃) films produced from Aluminum targets are widely used in insulating coatings due to their high dielectric strength and high-temperature stability.

Aluminum Al films are also extensively used in reflective coatings for optical devices and solar cells, as Aluminum Al offers excellent reflectivity across a wide range of wavelengths. In solar energy applications, Aluminum films can serve as reflective layers to enhance the efficiency of photovoltaic devices.

TFM provides customized Aluminum Al rotary sputtering targets, offering precise control over material purity and composition to meet the specific requirements of various industries. These targets deliver consistent, high-quality deposition results for electronics, optical coatings, and energy applications.

Our Aluminum Al rotary sputtering targets are manufactured with the highest standards, ensuring superior material quality and consistent deposition performance. With low impurity levels, high density, and optimized sputtering characteristics, TFM’s Aluminum Al targets are ideal for producing high-performance thin films for next-generation technologies.

Specifications

MaterialsAluminum Rotary Sputtering Target
SymbolAl
Purity99.99% – 99.999%
Theoretical Density (g/cc)2.7
Melting Point (°C)660
Production MethodSpraying Type / Monolithic Type
Backing TubeTitanium, Stainless Steel
SizeAs per customer’s drawings
Relative Density>= 96%
Grain Sizes< 100 µm
Annual Capacity1000 tons

Applications

  • Thin Film Photovoltaic Solar Industry
  • TFT-LCD Coating
  • Semiconductor Electronics Industry
  • Flat Panel Display Industry
  • Decorative / Functional Coating Industry

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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