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ST0482 Aluminum Lithium Sputtering Target, Al/Li

Chemical Formula: AlLi
Catalog Number: ST0482
CAS Number: 87871-87-2
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum-Lithium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Aluminum Lithium Sputtering Target (Al/Li) is a specialized alloy target used in physical vapor deposition (PVD) processes to produce lightweight, high-performance thin films. The addition of lithium to aluminum significantly alters the material’s density, electrical properties, and microstructural behavior, making Al/Li alloys particularly attractive for advanced electronics, energy storage technologies, and aerospace-related coatings.

In thin film deposition systems such as magnetron sputtering, Aluminum Lithium targets allow engineers and researchers to deposit alloy films with tailored mechanical strength, electrical conductivity, and low density. These characteristics make Al/Li sputtering targets valuable for next-generation electronic devices, battery technologies, and lightweight functional coatings.

Detailed Description

Aluminum Lithium (Al/Li) sputtering targets are manufactured from precisely controlled alloy compositions to ensure stable sputtering performance and consistent film deposition. Lithium is one of the lightest metallic elements, and when alloyed with aluminum it significantly reduces density while enhancing stiffness and specific strength. These characteristics are widely recognized in structural materials and are increasingly being explored in thin film technologies.

Producing Al/Li sputtering targets requires careful handling due to lithium’s high chemical reactivity. Advanced metallurgical processes such as vacuum induction melting, controlled atmosphere casting, and powder metallurgy are commonly used to ensure a homogeneous alloy composition while minimizing oxidation and contamination. The resulting targets typically exhibit high density, uniform microstructure, and reliable sputtering stability.

Because lithium can influence electrical conductivity, lattice structure, and electrochemical properties, thin films deposited from Al/Li targets are of particular interest in battery electrode research and advanced electronic materials. In some deposition systems, the alloy composition can be tuned to optimize film properties such as conductivity, adhesion, and structural stability.

To support high-power sputtering operations, Aluminum Lithium targets may be bonded to copper backing plates through indium bonding or diffusion bonding. This bonding structure improves thermal conductivity and reduces the risk of cracking during extended sputtering cycles.

High-purity Al/Li sputtering targets are especially important in semiconductor or electronic applications, where impurity levels must be minimized to ensure consistent thin film performance.

Applications

Aluminum Lithium Sputtering Targets are used in a variety of advanced thin film and research applications, including:

  • Battery research and energy storage – Thin film electrodes and experimental lithium-based battery materials

  • Microelectronics and semiconductor devices – Conductive and structural alloy thin films

  • Aerospace material research – Lightweight metallic coatings and alloy film studies

  • Functional coatings – Thin films requiring low density and good electrical conductivity

  • Materials science research – Development of novel aluminum-based alloy thin films

  • Protective and structural coatings for specialized electronic components

The combination of aluminum’s conductivity and lithium’s electrochemical activity enables new possibilities in emerging energy technologies.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures consistent thin film quality
Composition RatioAl/Li customizable (e.g., 95/5, 90/10)Influences electrical and electrochemical properties
Density≥ 95% theoretical densityProvides stable sputtering performance
Diameter25 – 300 mm (custom)Compatible with various sputtering systems
Thickness3 – 6 mmAffects sputtering lifetime and thermal stability
BondingCopper backing plate optionalImproves heat transfer and target durability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Aluminum Lithium (Al/Li)Extremely lightweight alloy with tunable electrochemical propertiesEnergy storage and advanced electronics
Aluminum (Al)High electrical conductivity and low costGeneral thin film coatings
Aluminum Copper (Al/Cu)Improved strength and electromigration resistanceSemiconductor interconnects
Lithium (Li)High electrochemical activityBattery research

FAQ

QuestionAnswer
Can the Aluminum Lithium Sputtering Target be customized?Yes, composition ratios, dimensions, purity levels, and bonding options can be tailored according to sputtering system requirements.
Is lithium stable during sputtering?When properly alloyed with aluminum and processed under controlled conditions, lithium can be deposited effectively in alloy thin films.
Are backing plates recommended for Al/Li targets?Yes, copper backing plates help dissipate heat and improve target stability during sputtering.
Which deposition methods are compatible with this target?Aluminum Lithium targets can be used in RF magnetron sputtering, DC sputtering, and other PVD systems.
Which industries use Al/Li sputtering targets?Battery research laboratories, semiconductor industries, aerospace materials research, and advanced electronics development.

Packaging

Our Aluminum Lithium Sputtering Target are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Aluminum Lithium Sputtering Targets provide a unique alloy source for depositing lightweight and functional thin films with tunable electrical and electrochemical properties. Their combination of low density, conductivity, and alloy flexibility makes them attractive for advanced electronics, battery research, and materials science applications.

With customizable compositions, high purity options, and reliable bonding configurations, Al/Li sputtering targets can meet the demanding requirements of modern thin film deposition systems.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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