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Aluminum Magnesium Boride Sputtering Target, AlMgB₁₄, 1:1:14

Introduction

The Aluminum Magnesium Boride (AlMgB₁₄, 1:1:14) Sputtering Target is a high-performance ceramic–metal composite material known for its exceptional hardness, low friction, and thermal stability. These attributes make it an attractive option for next-generation protective coatings, wear-resistant films, and advanced tribological surfaces used in engineering and scientific applications.

Detailed Description

Aluminum Magnesium Boride with a stoichiometric ratio of 1:1:14 is part of the AlMgB₁₄ family—materials recognized for extremely high microhardness and outstanding wear resistance. When fabricated into sputtering targets, the compound delivers films exhibiting strong mechanical stability, high temperature endurance, and reduced friction coefficients.

Our targets are produced using controlled powder synthesis, high-temperature hot pressing, and precision finishing to achieve uniform density and excellent grain structure. This ensures consistent sputtering behavior with minimized particle shedding during deposition. To support high-power PVD processes, optional copper (Cu) or titanium (Ti) backing plates may be applied, improving heat transfer and structural integrity.

Applications

  • Ultra-hard, low-friction coatings for industrial tooling

  • Tribological layers for automotive and aerospace components

  • Mechanical protection films for moving parts and precision assemblies

  • Research on superhard lightweight ceramic–metal composites

  • Wear-resistant functional coatings used in sensors and microsystems

  • Thin-film engineering in mechanical, defense, and electronic applications

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionAlMgB₁₄ (1:1:14)Stable superhard ceramic–metal composite
Purity99.5% – 99.9%Higher purity improves film quality
Diameter25 – 300 mm (custom)Fits most commercial sputtering systems
Thickness3 – 6 mmInfluences sputtering rate and durability
BondingCu / Ti backing optionalEnhances cooling and mechanical stability
FormsDisc / rectangular plateSuitable for planar sputtering setups

Comparison with Related Materials

MaterialKey AdvantageTypical Application
AlMgB₁₄Extremely high hardness & low frictionWear-resistant coatings
TitaniumGood adhesion and stabilityDecorative & functional layers
AluminumLightweight and economicalGeneral thin film coatings

FAQ

QuestionAnswer
Can the composition be customized?Yes. Variants within the AlMgB system can be fabricated on request.
Do you offer bonded targets?Yes. Cu or Ti backing plates are available for high-power sputtering.
What packaging is used?Vacuum-sealed with protective foam, shipped in secure export cartons or wooden crates.
Which industries use AlMgB₁₄ films?Automotive, aerospace, precision machinery, electronics, and academic research.
Do you support large-diameter targets?Yes. Custom sizes up to 300 mm diameter can be manufactured.

Packaging

Each Aluminum Magnesium Boride (AlMgB₁₄, 1:1:14) Sputtering Target is clearly labeled and vacuum-sealed to protect against moisture and environmental contamination. Reinforced cushioning and export-grade cartons ensure safe transport and handling.

Conclusion

The Aluminum Magnesium Boride (AlMgB₁₄) Sputtering Target offers a rare combination of superhardness, low friction, and thermal stability, making it ideal for protective and tribological thin films. We provide custom dimensions, bonded target options, and technical support tailored to diverse PVD system requirements.

For detailed specifications or a quotation, please contact us at sales@thinfilmmaterials.com.

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AlMgB Target AlMgB₁₄ (1:1:14) 3N Ø76.2 mm × 4 mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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