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ST0064 Aluminum Nickel Sputtering Target, Al/Ni

Chemical Formula: Al/Ni
Catalog Number: ST0064
CAS Number: 12003-78-0
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made
Aluminum Nickel sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Aluminum Nickel Sputtering Target Description

The aluminum nickel sputtering target from TFM is an alloy sputtering material containing aluminum (Al) and nickel (Ni).

Aluminum

Aluminum:

  • Origin: Derived from the Latin name for alum, ‘alumen’ meaning bitter salt.
  • Discovery: First mentioned in 1825 by H.C. Ørsted, who also accomplished its isolation.
  • Symbol: Al
  • Atomic Number: 13
  • Position in Periodic Table: Period 3, Group 13, p-block
  • Relative Atomic Mass: 26.9815386(8) Dalton

Nickel

Nickel:

  • Origin: Derived from the shortened German term ‘kupfernickel’, meaning either devil’s copper or St. Nicholas’s copper.
  • Discovery: First mentioned in 1751 and observed by F. Cronstedt, who also accomplished its isolation.
  • Symbol: Ni
  • Atomic Number: 28
  • Position in Periodic Table: Period 4, Group 10, d-block
  • Relative Atomic Mass: 58.6934(2) Dalton

The combination of aluminum and nickel in the sputtering target leverages the properties of both elements, making it suitable for various advanced applications.

Related Product: Aluminum Sputtering Target, Nickel Sputtering Target

Aluminum Nickel Sputtering Target Specification

Material TypeAluminum Nickel
SymbolAl/Ni
Color/AppearanceSilvery, Metallic Target
Melting Point1385 °C
Density7.5 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Aluminum Nickel Sputtering Target Application

The aluminum nickel sputtering materials are used for CD-ROMs, decoration, semiconductors, displays, LEDs, and photovoltaic devices. They are also utilized for functional coatings, optical information storage, the glass coating industry for car and architectural glass, optical communication, and other high-tech applications.

Aluminum Nickel Sputtering Target Packing

Our aluminum nickel sputter coater targets are meticulously tagged and labeled on the outside to guarantee easy identification and uphold strict quality control standards. We take extensive precautions to prevent any potential damage during storage or transit, ensuring that each target arrives in perfect condition.

Get Contact

TFM offers Aluminum Nickel Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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