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Aluminum Oxide Sputtering Target

ST0129 Aluminum Oxide Sputtering Target, Al2O3

Chemical Formula: Al2O3
Catalog Number: ST0129
CAS Number: 1344-28-1
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Aluminum Oxide Sputtering Target Description

AluminumOxygenThe Aluminum Oxide Sputtering Target from TFM is made up of aluminum (Al) and oxygen (O), and it shares the same properties as aluminum oxide. Chemically known as Al2O3, aluminum oxide is the most common form of aluminum oxides and is specifically referred to as aluminum (III) oxide. This sputter target is often called an alumina sputter target, but it may also be known as an aloxide target, aloxite target, or alundum target, depending on its specific forms or applications. Al2O3 naturally occurs in its crystalline polymorphic phase, α-Al2O3, as the mineral corundum, which includes the precious gemstones ruby and sapphire.

Aluminum Oxide Sputtering Target Specification

Chemical CompoundAluminum Oxide
SymbolAl2O3
Color/AppearanceWhite, Crystalline Solid
Melting Point2,072 °C
Theoretical Density3.97 g/cc
Z Ratio0.336
SputterRF-R
Type of BondIndium
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Aluminum Oxide Sputtering Target Application

The Aluminum Oxide Sputtering Target is extensively utilized for thin film deposition across a variety of applications, including fuel cells, decorative coatings, semiconductors, displays, LEDs, photovoltaic devices, and glass coatings. Specialty aluminum oxides are predominantly used in refractories, ceramics, and for polishing and abrasive applications. Additionally, substantial quantities of aluminum hydroxide, the precursor to alumina, are employed in the production of zeolites, coating titania pigments, and serving as a fire retardant and smoke suppressant.

Aluminum Oxide Sputtering Target Bonding Methods

Specialized bonding services for Aluminum Oxide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packaging

Aluminum Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the integrity of the products upon delivery.

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TFM offers Aluminum Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.
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Al2O3 Target 4N ø50.8*3mm, Al2O3 Target 4N ø50.8*6mm, Al2O3 Target 4N ø50.8*3mm w/. Cu B/Plate, Al2O3 Target 4N ø50.8*6mm w/. Cu B/Plate, Al₂O₃ Target 4N ø50.8*2.0mm w/. 1.0mm Cu B/Plate

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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