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ST0129 Aluminum Oxide Sputtering Target, Al2O3

Chemical Formula: Al2O3
Catalog Number: ST0129
CAS Number: 1344-28-1
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

COA_Al2O3_TRGPdf

Introduction

Aluminum Oxide Sputtering Target (Al₂O₃) is a key ceramic material widely used for forming dense, uniform, and electrically insulating thin films in semiconductor, optical, and protective coating applications. Its stability, compatibility with RF sputtering, and ability to generate high-quality dielectric layers make it essential for research laboratories and industrial thin-film production lines.

Detailed Description

Al₂O₃ sputtering targets are produced through high-temperature sintering or hot-pressing techniques to achieve near-theoretical density and a fine, uniform microstructure. High density is crucial for ensuring consistent sputtering rates, minimizing particle generation, and maintaining uniform erosion across the target surface.

Purity levels typically range from 99.9% to 99.99%, and selecting the appropriate purity depends on the required film properties. High-purity Al₂O₃ minimizes unwanted ionic contaminants that can influence dielectric strength, optical transparency, or adhesion in functional coatings.

Target sizes are fully customizable, from 1” circular pieces to large rectangular plates used in architectural glass coatings. Bonding options such as indium, elastomer, or Cu/Ti backing plates help improve heat dissipation and mechanical stability during high-power sputtering operations.

Applications

Aluminum Oxide Sputtering Targets are used widely in:

  • Semiconductors & Microelectronics
    • Gate dielectrics, insulating layers, passivation coatings

  • Optical Coatings
    • Anti-reflection films, protective layers for lenses and IR windows

  • Display Manufacturing
    • TFT dielectric layers, transparent coatings

  • Wear-Resistant & Protective Films
    • Hard, stable coatings for industrial and aerospace components

  • Energy & Storage Devices
    • Barrier layers and protective coatings in lithium batteries and solid-state devices

  • R&D and Advanced Material Engineering
    • Photonics, microfabrication, sensor development, and thin-film ceramics research

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity improves dielectric strength and reduces contaminants
Diameter25 – 300 mm (custom)Matches most RF and magnetron sputtering systems
Thickness3 – 10 mmAffects sputtering lifetime and target strength
Density3.85 – 3.95 g/cm³Higher density improves film uniformity & reduces cracking
BondingIndium / Elastomer / Cu or Ti back plateEnhances heat transfer and deposition stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Al₂O₃Excellent dielectric strength & chemical resistanceSemiconductors, optical coatings
SiO₂Low refractive index, high transparencyOptical layers & insulation
MgOHigh thermal conductivity & good adhesionSuperconductor and protective films

FAQ

QuestionAnswer
Can the product be customized?Yes. Purity, size, thickness, bonding, and geometry can all be customized.
How is it packaged?Vacuum-sealed with foam protection, placed in export-safe cartons or wooden crates.
Which industries use it most?Semiconductor, optics, aerospace, display manufacturing, and energy storage.
Do you offer bonding services?Yes, including indium bonding, elastomer bonding, and Cu/Ti backing plates.
Is Al₂O₃ suitable for RF sputtering?Yes. Due to its insulating nature, it is widely used in RF sputtering systems.

Packaging

Each Aluminum Oxide Sputtering Target is vacuum-sealed to prevent contamination and moisture absorption. External labeling ensures easy identification, and targets are protected with foam cushioning and sturdy export packaging to prevent damage in transit.

Conclusion

Al₂O₃ sputtering targets deliver reliable performance, excellent dielectric properties, and exceptional chemical durability, making them ideal for advanced thin-film deposition in semiconductor, optical, and protective applications. Custom design, consistent quality, and reliable delivery ensure that these targets meet the demanding requirements of research institutions and industrial production environments.

For detailed specifications or a quotation, please contact us at:
📩 sales@thinfilmmaterials.com

Order Now

Al2O3 Target 4N ø50.8*3mm, Al2O3 Target 4N ø50.8*6mm, Al2O3 Target 4N ø50.8*3mm w/. Cu B/Plate, Al2O3 Target 4N ø50.8*6mm w/. Cu B/Plate, Al₂O₃ Target 4N ø50.8*2.0mm w/. 1.0mm Cu B/Plate, Al₂O₃ target ø4"×6mm 3N, Al₂O₃ Target 4N Ø2"×0.25" In Bonded 2 mm Cu BP with Keeper (2 pcs), Al2O3 99.99%, 1.00" Dia. × 0.125" Thick ST0129-01, Al2O3 99.999%, 1.00" Dia. × 0.125" Thick ST0129-02, Al2O3 99.99%, 1.00" Dia. × 0.250" Thick ST0129-03, Al2O3 99.999%, 1.00" Dia. × 0.250" Thick ST0129-04, Al2O3 99.99%, 2.00" Dia. × 0.125" Thick ST0129-05, Al2O3 99.999%, 2.00" Dia. × 0.125" Thick ST0129-06, Al2O3 99.99%, 2.00" Dia. × 0.250" Thick ST0129-07, Al2O3 99.999%, 2.00" Dia. × 0.250" Thick ST0129-08, Al2O3 99.99%, 3.00" Dia. × 0.125" Thick ST0129-09, Al2O3 99.999%, 3.00" Dia. × 0.125" Thick ST0129-10, Al2O3 99.99%, 3.00" Dia. × 0.250" Thick ST0129-11, Al2O3 99.999%, 3.00" Dia. × 0.250" Thick ST0129-12, Al2O3 99.99%, 4.00" Dia. × 0.125" Thick ST0129-13, Al2O3 99.999%, 4.00" Dia. × 0.125" Thick ST0129-14, Al2O3 99.99%, 4.00" Dia. × 0.250" Thick ST0129-15, Al2O3 99.999%, 4.00" Dia. × 0.250" Thick ST0129-16, Al2O3 99.99%, 6.00" Dia. × 0.250" Thick ST0129-17, Al2O3 99.999%, 6.00" Dia. × 0.250" Thick ST0129-18, Al2O3 99.99%, 8.00" Dia. × 0.250" Thick ST0129-19, Al2O3 99.999%, 8.00" Dia. × 0.250" Thick ST0129-20

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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