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Aluminum Silicon Evaporation Materials

VD0600 Aluminum Silicon Evaporation Materials, Al/Si

Catalog No.VD0600
MaterialAluminum Silicon (Al/Si)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM specializes in producing high-purity aluminum silicon evaporation materials, ensuring exceptional product reliability through rigorous quality assurance processes. Our aluminum silicon evaporation materials are available in various forms, including tablets, granules, rods, and wires, tailored to meet diverse application requirements.

MSDS File

Aluminum Silicon Evaporation Materials

TFM offers high-quality aluminum silicon evaporation materials, which are alloys containing aluminum (Al) and silicon (Si). These materials are integral to various deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are particularly useful in optical applications for wear protection, decorative coatings, and display technologies.

Applications

  • Deposition Processes: Suitable for semiconductor deposition, CVD, and PVD.
  • Optics: Ideal for wear protection, decorative coatings, and displays.

Packaging and Handling

We ensure that our aluminum silicon evaporation materials are carefully packaged to prevent any damage during storage and transportation. This meticulous handling helps preserve the products’ quality and integrity.

What We Supply

TFM provides a wide range of evaporation materials, including:

  • Pure Metals and Alloys: Various compositions and forms.
  • Ceramic Oxides: Including rare earth oxides such as Sc2O3, Y2O3, La2O3, and other ceramics like fluorides and nitrides.
  • Forms: Available in tablets, granules, rods, and wires. Custom shapes and quantities can be provided upon request.
  • Additional Components: We also supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners.

For current pricing and availability of evaporation pellets and other deposition materials not listed, please contact us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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