ST0001 Aluminum Sputtering Target, Al

Chemical Formula: Al
Catalog Number: ST0001
CAS Number: 7429-90-5
Purity: 99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Aluminum Sputtering Target Description

Aluminum Element Aluminum
BauxiteBauxit

Aluminum sputtering targets share the same properties as metallic aluminum, a silvery-white, soft, non-magnetic, and ductile metal. Aluminum constitutes about 8% of the Earth’s crust, making it the third most abundant element after oxygen and silicon. Although aluminum is the most plentiful metal in the crust, it is rare in pure form due to its high reactivity.

Aluminum is typically found in over 270 minerals, with bauxite being the primary ore, consisting mainly of hydrated alumina and varying amounts of iron oxides. Aluminum layers are used for reflective coatings in telescopes, automotive headlamps, mirrors, packages, and toys. Aluminum sputtering targets and evaporation materials are extensively utilized in aerospace, automotive lighting, OLED, and optical    industries.

 

Aluminum Sputtering Target Specification

Material TypeAluminum
SymbolAl
Color/AppearanceSilvery, Metallic
Melting Point660°C
Density2700 kg/m3
SputterDC
Type of BondIndium, Elastomer
CommentsAlloys W/Mo/Ta. Flash evap or use BN crucible
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Aluminum Sputtering Target Application

Aluminum, known for its excellent thermal properties, is both malleable and ductile. Aluminum and its alloys are commonly used in aircraft assemblies and engine components. The aluminum sputtering target is utilized for thin film deposition in applications such as fuel cells, decorative coatings, semiconductors, displays, LEDs, photovoltaic devices, and glass coatings.

Aluminum Sputtering Target Bonding Services

Specialized bonding services for Aluminum Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Aluminum Sputtering Target Manufacturing processes

  • Production and purification of aluminum

Aluminum is extracted from bauxite by isolating Al2O3 and then electrolyzing it in molten cryolite, achieving a purity above 99%. However, this level of purity is insufficient for aluminum sputter targets, which require extremely high purity. High-purity aluminum, used for sputter targets, is produced using segregation, three-layer electrolysis, or combined regional melting methods, making it more expensive than industrial-grade aluminum. TFM offers high-quality aluminum targets at competitive prices.

Alunium target
Aluminum Sputtering Target
  • Deformation treatment of aluminum sputtering target

High-purity aluminum ingots are forged, rolled, and heated to refine the crystal grains and increase density, meeting the standards for aluminum sputtering targets. The processed aluminum material is then shaped into the specific target size needed for vacuum coating, requiring high precision and superior surface quality.

Aluminum Sputtering Target Packing

Our Aluminum Sputtering Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

Get Contact

TFM offers Aluminum Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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