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VD0535 (Discontinued) Antimony (Sb) Evaporation Materials

Material Type:Antimony
Symbol:Sb
Color/Appearance:Silvery, Lustrous Gray, Semi-metallic
Purity:99.9% ~ 99.999%
Shape:Powder/ Granule/ Custom-made

TFM provides high-purity antimony evaporation materials, establishing itself as a leading manufacturer and supplier in the industry. We offer these materials in various forms, including powder and granule, with customized options available upon request.

Antimony Evaporation Materials Description

Antimony is a bluish-white, brittle metal with low thermal and electrical conductivity. At room temperature, it remains stable in air but converts to antimony trioxide (Sb₂O₃) when heated. When melted, antimony can be alloyed to strengthen and harden other metals. Antimony ingots are highly resistant to corrosion and oxidation, making them suitable for various chemical processes. They are cost-effective and commonly used in general applications.

High-purity antimony evaporation materials are crucial for achieving high-quality films in deposition processes. TFM specializes in producing antimony evaporation materials with purity levels of up to 99.999%, supported by rigorous quality assurance to ensure dependable performance.

antimony evaporation materials

Antimony Evaporation Materials Specification

Material TypeAntimony
SymbolSb
Color/AppearanceSilvery, Lustrous Gray, Semi-metallic
Melting Point630 °C
SputterRF, DC
Density6.68 g/cc
Thermal Conductivity24 W/m.K

Antimony Evaporation Materials Application

  • Deposition Processes: Employed in semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Utilized for wear protection, decorative coatings, and display technologies.

Antimony Evaporation Materials Packaging

We carefully handle our antimony evaporation pellets to prevent damage during storage and transportation, ensuring that their quality remains preserved in their original condition.

Ordering Table

Material Size Quantity Purity Part Number
Antimony 1mm - 3mm Pieces 1 lb. 99.999% EVMSB501141
Antimony 1mm - 3mm Pieces 25 g 99.999% EVMSB501141A
Antimony 1mm - 3mm Pieces 50 g 99.999% EVMSB501141B
Antimony 1mm - 3mm Pieces 100 g 99.999% EVMSB501141D
Antimony 1mm - 3mm Pieces 500 g 99.999% EVMSB501141T
Antimony 3mm - 6mm Pieces 25 g 99.999% EVMSB5036MMA

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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