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ST0506 Antimony Indium Tin Sputtering Target, Sb/In/Sn

Chemical Formula: Sb/In/Sn
Catalog Number: ST0506
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Antimony Indium Tin sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Antimony Indium Tin Sputtering Target Description

Antimony

Antimony is a lustrous gray metalloid primarily found in nature as the sulfide mineral stibnite (Sb₂S₃). Historically, antimony compounds were used in ancient medicine and cosmetics, particularly known by the Arabic term “kohl.” Although metallic antimony was recognized in ancient times, it was initially mistaken for lead. The first detailed description of antimony in the Western world was provided by Vannoccio Biringuccio in 1540. Today, industrial refining of antimony is achieved through processes such as roasting and reduction with carbon or direct reduction of stibnite using iron.

IndiumIndium is a chemical element named from the Latin word “indicium,” meaning violet or indigo, due to the indigo line in its atomic spectrum. It was first identified in 1863 by F. Reich and T. Richter, with its isolation later achieved and announced by T. Richter. The element’s symbol is “In,” and it occupies Period 5, Group 13 in the periodic table. With an atomic number of 49, indium belongs to the p-block of elements. Its relative atomic mass is 114.818(3) Dalton, where the number in parentheses denotes the uncertainty in measurement.

Tin

Tin, also known by its Latin name “stannum,” is a chemical element that derives its name from the Anglo-Saxon word for the metal, “tin,” which translates to “hard” in Latin. Tin has been used since around 3500 BC. Its chemical symbol is “Sn,” and it is positioned in Period 5, Group 14 of the periodic table, within the p-block. Tin’s atomic number is 50, and its relative atomic mass is 118.710(7) Dalton, with the number in parentheses reflecting the uncertainty in the measurement.

Related Products: Antimony Sputtering Target, Indium Sputtering Target, Tin Sputtering Target.

Antimony Indium Tin Sputtering Target Specifications

Material TypeAntimony Indium Tin
SymbolSb/In/Sn
Color/AppearanceSolid
Melting Point/
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Antimony Indium Tin Sputtering Target Application

The Antimony Indium Tin Sputtering Target is utilized in various applications, including thin film deposition, decorative coatings, and semiconductor manufacturing. It is ideal for use in display technologies, LED and photovoltaic devices, as well as functional coatings. Additionally, it finds applications in the optical information storage industry, glass coatings (such as those used in automotive and architectural glass), and optical communication systems.

Packing

Our Antimony Indium Tin Sputtering Targets are meticulously tagged and labeled to ensure clear identification and strict quality control. We take extensive precautions to prevent any damage during storage or transportation, ensuring that the targets arrive in optimal condition.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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