Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
antimony-indium-tin-sbinsn-sputtering-target-removebg-preview

ST0506 Antimony Indium Tin Sputtering Target, Sb/In/Sn

Chemical Formula: Sb/In/Sn
Catalog Number: ST0506
Purity: 99%~99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Antimony Indium Tin sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Antimony Indium Tin Sputtering Target

Introduction

The Antimony Indium Tin Sputtering Target is a multi-component alloy target designed for advanced thin film deposition. By combining the semiconducting properties of indium, the conductivity of tin, and the modifying characteristics of antimony, this material enables the production of films with tailored electrical, optical, and structural performance. It is particularly attractive for next-generation optoelectronic devices, transparent conductive coatings, and research in compound semiconductors.

Detailed Description

Antimony Indium Tin sputtering targets are manufactured through powder metallurgy and vacuum sintering, resulting in a dense, homogeneous target that delivers stable sputtering rates and uniform thin film composition.

Key features include:

  • High Purity (≥99.9%) – ensures low contamination and reproducible film properties.

  • Optimized Alloy Composition – Sb, In, and Sn can be tuned in different atomic ratios depending on customer requirements.

  • Stable Microstructure – minimizes cracking and enables long target life.

  • Custom Bonding Options – available with Indium or Elastomer bonding to copper backing plates for high-power sputtering systems.

These properties allow precise control of thin film characteristics, especially in applications where transparency, conductivity, and thermal stability must be balanced.

Applications

Antimony Indium Tin Sputtering Targets are widely used in:

  • Transparent Conductive Films (TCFs) – for displays, touch panels, and photovoltaics.

  • Semiconductor Devices – functional layers in electronic and optoelectronic components.

  • Thin Film Photovoltaics – coatings for solar cell electrodes and active layers.

  • Optical Coatings – films with tailored refractive and conductive properties.

  • R&D in Advanced Materials – studies on ternary/quaternary compound semiconductors.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures high-quality thin films
CompositionSb/In/Sn (custom ratios available)Tailors conductivity & transparency
Diameter25 – 200 mmFits standard sputtering systems
Thickness3 – 10 mmAffects deposition stability
BondingIndium / Elastomer / Copper backingImproves thermal management

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Antimony Indium TinTunable optical/electrical propertiesTransparent conductive films, semiconductors
Indium Tin Oxide (ITO)High transparency & conductivityTouchscreens, displays
Antimony Tin Oxide (ATO)Cost-effective, stable coatingsGlass coatings, sensors

FAQ

QuestionAnswer
Can the Sb/In/Sn ratio be customized?Yes, we provide standard and tailored compositions depending on application.
What industries use this target?Electronics, photovoltaics, display technology, and optical coating industries.
How is it packaged?Each target is vacuum-sealed, cushioned with protective foam, and shipped in export-grade cartons or wooden crates.
Is bonding available?Yes, indium and elastomer bonding to copper plates are available for stability in high-power sputtering.
What deposition methods are suitable?Primarily magnetron sputtering (DC or RF) in thin film production lines.

Packaging

Each Antimony Indium Tin Sputtering Target is vacuum-sealed in moisture-protective packaging and externally labeled for traceability. Targets are secured with foam inserts and shipped in sturdy export cartons or wooden crates, ensuring they arrive in perfect condition.

Conclusion

The Antimony Indium Tin Sputtering Target is a versatile alloy target material offering a balance of conductivity, transparency, and stability. With customizable composition, high purity, and reliable bonding options, it serves as a dependable choice for thin film applications in electronics, photovoltaics, and optics.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

Reviews

There are no reviews yet.

Be the first to review “ST0506 Antimony Indium Tin Sputtering Target, Sb/In/Sn”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top