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VD0669 Antimony Oxide Evaporation Materials, Sb2O3

Catalog No.VD0669
MaterialAntimony Oxide (Sb2O3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity Sb2O3 antimony oxide evaporation materials, among a broad range of evaporation products. Our materials are available in both powder and granule forms, with options for custom specifications upon request.

MSDS File

Antimony Oxide Evaporation Materials Overview

Antimony oxide, with the chemical formula Sb2O3, is a critical material used in evaporation processes. Known for its high purity, antimony oxide is essential in achieving superior quality in deposited films. At TFM, we specialize in producing antimony oxide evaporation materials with purity levels up to 99.9995%, ensuring outstanding performance and reliability.

Applications of Antimony Oxide Evaporation Materials

Our antimony oxide materials are utilized in various advanced applications, including:

  • Deposition Processes: Key for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Applied in wear protection, decorative coatings, and display technologies.

Packaging and Quality Control

To ensure optimal quality and easy identification, antimony oxide evaporation materials are clearly tagged and labeled. Our packaging is designed to prevent damage during storage and transportation, maintaining the integrity of the products.

Contact Us

TFM is your trusted supplier for high-purity Sb2O3 antimony oxide evaporation materials, available in various forms such as tablets, granules, rods, and wires. We also offer customized solutions to meet specific needs. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and additional information on products not listed, please send us an inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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