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ST0271 Antimony Sulfide Sputtering Target, Sb2S3

Chemical Formula: Sb2S3
Catalog Number: ST0271
CAS Number: 1345-04-6
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

MSDS File

Antimony Sulfide Sputtering Target Description

An antimony sulfide sputtering target is a type of ceramic sputtering material composed of antimony (Sb) and sulfur (S). This material is commonly used in various thin film deposition applications due to its specific properties. The target’s composition makes it suitable for creating films with unique electrical and optical characteristics, often utilized in the semiconductor industry, photovoltaic devices, and other advanced technological applications.

AntimonyAntimony is a lustrous gray metalloid found predominantly in nature as the sulfide mineral stibnite (Sb2S3). Historically, antimony compounds were utilized in medicine and cosmetics, commonly referred to as kohl in Arabic culture. The metallic form of antimony was known in ancient times but was often mistakenly identified as lead. The earliest detailed description of metallic antimony in Western literature dates back to 1540, written by Vannoccio Biringuccio. Industrially, antimony is refined through methods such as roasting and reduction with carbon, or by direct reduction of stibnite using iron.

Related Product: Antimony Sputtering Target

SulfurSulfur, also known as sulphur, is a chemical element whose name may originate from either the Sanskrit word ‘sulvere’ or the Latin ‘sulfurium,’ both referring to sulfur. It has been known and used since ancient times, with records of its use dating back to before 2000 BC, notably by the Chinese and Indians. The chemical symbol for sulfur is “S,” and it holds the atomic number 16 on the periodic table, located in Period 3 and Group 16, part of the p-block. The relative atomic mass of sulfur is 32.065(5) Dalton, with the number in parentheses indicating the uncertainty of the measurement.

Antimony Sulfide Sputtering Target Specification

Compound FormulaSb2S3
AppearanceGray, Crystalline Solid
Density4.12 g/cc
Melting Point550℃
Type of BondIndium, Elastomer
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Antimony Sulfide Sputtering Target Application

The antimony sulfide sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Antimony Sulfide Sputtering Target Packing

Our antimony sulfide sputter targets are meticulously tagged and labeled externally to guarantee efficient identification and quality control. We take great care during storage and transportation to prevent any potential damage, ensuring that the products arrive in excellent condition.

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TFM offers antimony sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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