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AZO Sputtering Target, Aluminum-doped Zinc Oxide

Chemical Formula: AZO
Catalog Number: TFM-SPT-0035
CAS Number: 37275-76-6
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum-Doped Zinc Oxide (AZO) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

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Product Overview

AZO Sputtering Target (Aluminum-doped Zinc Oxide) is a conductive-oxide sputtering target used to deposit transparent or semiconducting functional thin films. In this material family, target density, dopant level, resistivity, sputtering mode, oxygen partial pressure, and substrate temperature can all influence the balance between film conductivity, optical transmission, composition, and microstructure.


Aluminum
Zinc

Material and Deposition Characteristics

Conductive-oxide sputtering is strongly affected by target density, resistivity, dopant content, power density, working pressure, oxygen content, substrate temperature, and film thickness. RF magnetron sputtering is broadly applicable to ceramic targets, while sufficiently conductive grades may also be compatible with DC or pulsed-DC systems depending on equipment design. The process window should ultimately be tuned against measured film electrical and optical performance.

Technical Data

Material TypeAluminum doped Zinc Oxide
SymbolAZO
AppearanceSolid in various forms
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Typical Thin-Film Applications

  • Transparent conductive oxide coatings for displays, photovoltaics, smart windows, sensors, and optoelectronics
  • Thin-film electronics and transparent electrode development
  • Projects balancing optical transmission, conductivity, and process compatibility

Target Configuration and Ordering Considerations

When requesting a quotation, provide target diameter or rectangular dimensions, thickness, purity or composition, required quantity, and whether a backing plate or bonded assembly is needed. For brittle ceramic or compound targets, it is useful to specify the cathode model, backing-plate material, preferred bonding method, operating power if known, and any density, tolerance, or inspection-document requirements. TFM can review drawings, old-target photos, and application details when custom dimensions are required.

Frequently Asked Questions

What are AZO sputtering targets used for?

They are used to deposit transparent conductive or semiconducting oxide films for displays, photovoltaics, smart windows, sensors, and other thin-film electronic or optoelectronic applications.

Can AZO targets be sputtered with RF or DC power?

RF sputtering is widely applicable to ceramic conductive-oxide targets. Depending on target resistivity and equipment capability, some grades may also be compatible with DC or pulsed-DC operation.

Why is target density important for AZO?

Higher and more uniform density generally supports more stable erosion and can reduce pores, particles, local hot spots, and arc-related problems. Density should be considered together with microstructure and bonding quality.

How do oxygen partial pressure and power affect AZO films?

These parameters can influence film composition, carrier concentration, resistivity, transparency, and microstructure. The process window should therefore be optimized against the actual film-performance targets.

Can the dopant level or composition of AZO be customized?

Yes. The required composition should be stated clearly in the RFQ so that the target formulation and any acceptance criteria can be agreed before production.

What information should I provide to request a AZO target quotation?

Please provide composition, purity basis, dimensions, quantity, planar or rotary format, backing requirement, cathode model if known, and any density, resistivity, optical, or documentation requirements.

Order Now

AZO Target 97:3 wt% 4N ø50.8*5mm, AZO Target 98:2 wt% 4N ø76.0*5.5mm, AZO Target 4N ø76.2*3.18mm Indium Bonded 3mm Cu B/Plate, AZO Target (ZnO/Al₂O₃ 98–2 wt%) 4N Ø2"×0.25" In Bonded 2 mm Cu BP with Keeper (1 pc), AZO ZnO(97) / Al₂O₃(3) at%, Ø1/16″ target + Ø1/16″ bonding, Ø50.8 × 3.18 mm (2" × 1/8"), AZO TRG, ZnO-Al2O3 98/2 wt%, 4N, Ø50.8 × 6.35 mm (2" × 1/4"), AZO TRG, ZnO-Al2O3 98/2 wt%, 4N

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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