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ST0133 Barium Strontium Titanate Sputtering Target, Ba0.5Sr0.5TiO3

Chemical Formula: Ba0.5Sr0.5TiO3
Catalog Number: ST0133
CAS Number: 12430-73-8
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Barium Strontium Titanate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Barium Strontium Titanate Sputtering Target Description

The Barium Strontium Titanate Sputtering Target from TFM is a compound sputtering material with the chemical formula Ba0.5Sr0.5TiO3.

BariumBarium is the fifth element in group 2 of the periodic table and is classified as a soft, silvery alkaline earth metal. Due to its high chemical reactivity, barium is never found in nature as a free element. Barium hydroxide, historically known as baryta, does not occur naturally as a mineral but can be produced by heating barium carbonate. The most common naturally occurring barium minerals are barite (barium sulfate, BaSO4) and witherite (barium carbonate, BaCO3), both of which are insoluble in water. The name barium is derived from the alchemical term “baryta,” originating from the Greek word βαρύς (barys), meaning “heavy.”

Related Product: Barium (Ba) Sputtering Target

StrontiumStrontium is a chemical element named after Strontian, a small town in Scotland. It was first mentioned in 1787 and observed by W. Cruikshank. The isolation of strontium was later accomplished and announced by H. Davy. The chemical symbol for strontium is “Sr,” and it has an atomic number of 38. Strontium is located in Period 5, Group 2 of the periodic table, belonging to the s-block. Its relative atomic mass is 87.62(1) Dalton, with the number in parentheses indicating the uncertainty.

Related Product: Strontium (Sr) Sputtering Target

TitaniumTitanium is a chemical element named after the Titans, the sons of the Earth goddess in Greek mythology. It was first mentioned in 1791 and observed by W. Gregor. The isolation of titanium was later accomplished and announced by J. Berzelius. The chemical symbol for titanium is “Ti,” and it has an atomic number of 22. Titanium is located in Period 4, Group 4 of the periodic table, belonging to the d-block. Its relative atomic mass is 47.867(1) Dalton, with the number in parentheses indicating the uncertainty.

Related Product: Titanium (Ti) Sputtering Target

OxygenOxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and it has an atomic number of 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in parentheses indicating the uncertainty of the measurement.

Barium Strontium Titanate Sputtering Target Handling Notes

1. Elastomer bonding is recommended for the Ba0.5Sr0.5TiO3 sputtering target due to its characteristics such as brittleness and low thermal conductivity, which make it less suitable for traditional sputtering methods.

2. This material has low thermal conductivity and is susceptible to thermal shock.

Barium Titanate Sputtering Target Application

The Barium Strontium Titanate Sputtering Target is used in a wide range of applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also crucial for functional coatings, the optical information storage industry, glass coatings for automotive and architectural purposes, and optical communication systems, among other fields.

Barium Titanate Sputtering Target Packing

Our Barium Strontium Titanate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and stringent quality control. We take extensive precautions to prevent any damage during storage and transportation, maintaining the highest standards of product integrity upon delivery.

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TFM offers  Barium Strontium Titanate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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