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ST0003 Barium Sputtering Target, Ba

Chemical Formula: Ba
Catalog Number: ST0003
CAS Number: 7440-39-3
Purity: >99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Barium Sputtering Targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Availability: 99 in stock

Barium Sputtering Target Description

BariumBarium sputtering targets are made from high-purity barium metal. Barium, a soft, silvery alkaline earth metal and the fifth element in group 2, is highly reactive and never found free in nature. Barium hydroxide, historically known as baryta, is not a natural mineral but is produced by heating barium carbonate. The primary natural barium minerals are barite (barium sulfate, BaSO4) and witherite (barium carbonate, BaCO3), both insoluble in water. The name “barium” comes from the Greek word “barys,” meaning “heavy.”

Barium Sputtering Target Specifications

Material Type Barium
Symbol Ba
Color/Appearance Silvery White, Metallic
Melting Point 725 °C
Density 3.51 g/cm3
Sputter RF
Type of Bond /
Comments Wets without alloying, reacts with ceramics. Not recommended for sputtering.
Available Sizes Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Barium Sputtering Target Application

Barium sputtering targets are utilized for depositing barium thin films, which act as lubricants on anode rotors in vacuum X-ray tubes. Key barium compounds include carbonate, nitrate, oxide, and sulfate. Barium carbonate is used in chemical applications, salt brine treatment to remove sulfates, ceramic flux, and in optical and fine glassware. Barium nitrate (Ba(NO3)2) creates green colors in flares, pyrotechnics, and tracer bullets. Barium oxide is involved in making lubricating oil detergents, while barium sulfate is used in paint pigments and cosmetics. Additionally, barium sulfate is crucial in X-ray photography of the gastrointestinal tract, providing an opaque medium for contrast.

Barium Sputtering Target Packing

Our Barium Sputter Targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation.

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TFM offers Barium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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