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Bismuth Chromite Sputtering Target

Bismuth Chromite Sputtering Target

Introduction

Bismuth Chromite Sputtering Target is a specialized ceramic target material used in advanced thin film deposition processes. It plays a critical role in producing high-quality films with tailored electronic, magnetic, and optical properties. Due to its complex oxide composition, this target is particularly valued in research and industrial applications related to multiferroics, spintronics, and energy storage devices.

Detailed Description

Bismuth Chromite (BiCrO₃) is a perovskite-structured oxide with unique dielectric and magnetic characteristics. When fabricated into a sputtering target, it allows for controlled deposition of uniform thin films that exhibit multifunctional properties. Typical targets are manufactured through high-temperature sintering of high-purity powders, ensuring excellent phase purity, density, and mechanical stability.

Key features include:

  • Purity: Typically available at 99.9% or higher, ensuring minimal contamination in thin film processes.

  • Density & Microstructure: Optimized for high deposition rates and stable plasma performance.

  • Form Factor: Available in various diameters (25–300 mm) and thicknesses (3–6 mm), with or without backing plates for improved thermal conductivity.

  • Bonding: Copper or titanium backing plates are used to enhance heat dissipation during high-power sputtering.

The combination of bismuth and chromium oxides provides unique ferroelectric and magnetic properties, making the films suitable for multifunctional device research.

Applications

Bismuth Chromite Sputtering Target is widely applied in:

  • Multiferroic thin films for advanced electronics

  • Spintronics research and devices

  • Ferroelectric capacitors and memory storage technologies

  • Optical and magneto-optical coatings

  • Energy and environmental devices, including photocatalysts and solid oxide fuel cells

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity ensures film reliability
Diameter25 – 300 mm (custom)Compatible with laboratory and industrial sputtering systems
Thickness3 – 6 mmAffects film growth rate and target lifetime
BondingCopper / Titanium backingEnhances heat transfer and target stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Bismuth ChromiteMultiferroic & spintronic propertiesAdvanced electronics, multifunctional devices
Bismuth FerriteStrong ferroelectric behaviorNon-volatile memory, sensors
Chromium OxideHigh hardness, optical transparencyProtective & optical coatings

FAQ

QuestionAnswer
Can the target be customized?Yes, dimensions, purity, and bonding configurations can be tailored.
How is it packaged?Vacuum-sealed, cushioned with protective foam, and shipped in export-safe cartons or wooden crates.
What deposition methods are compatible?Primarily magnetron sputtering (DC/RF), with potential use in pulsed laser deposition (PLD).
Which industries use it most?Semiconductor research, spintronics, optics, and renewable energy sectors.
Is bonding necessary?For high-power sputtering, bonding with copper or titanium backing is recommended.

Packaging

Our Bismuth Chromite Sputtering Targets are carefully labeled and vacuum-sealed to maintain purity. Each target is securely cushioned and packed in export-grade cartons or wooden crates to avoid mechanical damage during storage and transportation.

Conclusion

Bismuth Chromite Sputtering Target is a high-performance material designed for researchers and industries working on next-generation electronic, optical, and energy devices. With excellent purity, strong thermal stability, and customizable options, it provides reliable performance in demanding deposition environments.

For detailed specifications or a quotation, please contact us at sales@thinfilmmaterials.com.

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BiCrO₃ target 4N ø25.4×3.18mm Multi-Phase

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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