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VD0675 Bismuth Ferrite Evaporation Materials, BiFeO3

Catalog No.VD0675
MaterialBismuth Ferrite (BiFeO3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity bismuth ferrite evaporation materials, along with a diverse range of other evaporation materials. We provide these materials in both powder and granule forms, and we can also create custom formulations to meet specific requirements.

MSDS File

Bismuth Ferrite Evaporation Materials Overview

TFM offers high-purity bismuth ferrite evaporation materials, with the chemical formula BiFeO3. These materials are crucial for achieving high-quality films in various deposition processes. Our bismuth ferrite evaporation materials are produced with exceptional purity, reaching up to 99.9995%, and are backed by rigorous quality assurance to ensure consistent performance.

Related Products: Bismuth Evaporation Materials, Iron Evaporation Materials, Oxide Ceramic Evaporation Materials

Applications of Bismuth Ferrite Evaporation Materials

Bismuth ferrite evaporation materials are versatile and used in several applications:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Applied in wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our bismuth ferrite evaporation materials are carefully tagged and labeled to facilitate accurate identification and quality control. We prioritize protection during storage and transportation to prevent any potential damage.

Contact Us

TFM is a leading provider of high-purity bismuth ferrite evaporation materials, available in various forms such as tablets, granules, rods, and wires. We also offer customized shapes and quantities to meet specific needs. In addition to our evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and information on materials not listed, please reach out to us with your inquiry.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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