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bismuthiii-sulfide

VD0812 Bismuth(III) Sulfide Evaporation Materials, Bi2S3

Catalog No.VD0812
MaterialBismuth Sulfide (Bi2S3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier of high-purity bismuth(III) sulfide (Bi₂S₃) evaporation materials. Our offerings include a diverse range of evaporation materials, available in both powder and granule forms. For specific needs, we also provide customized forms upon request to meet unique application requirements.

MSDS File
Bismuth(III) Sulfide Evaporation Materials Overview

TFM provides high-purity bismuth(III) sulfide (Bi₂S₃) evaporation materials, a key component in producing high-quality films during various deposition processes. Our bismuth(III) sulfide materials are renowned for their purity, reaching up to 99.9995%, and are manufactured under strict quality control protocols to ensure exceptional reliability.

Related Products: Bismuth Evaporation Materials, Sulfide Ceramic Evaporation Materials

Bismuth(III) Sulfide Evaporation Materials Specification

Material TypeBismuth(III) sulfide
SymbolBi2S3
Appearance/ColorBrown solid
Melting Point850 ˚C
Density6.78 g/cm3
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications of Bismuth(III) Sulfide Evaporation Materials

Our bismuth(III) sulfide evaporation materials are employed in various deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). They are particularly useful in optical applications such as wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

We ensure that our bismuth(III) sulfide evaporation materials are thoroughly tagged and labeled for clear identification and quality control. Each package is carefully handled to prevent damage during storage and transportation.

Contact Us

TFM is a leading provider of high-purity bismuth(III) sulfide evaporation materials, offering them in various shapes such as tablets, granules, rods, and wires. Customized forms and quantities are available to meet specific needs. We also supply additional evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing and further information on our products, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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