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bismuth-titanate

VD0678 Bismuth Titanate Evaporation Materials, Bi4Ti3O12

Catalog No.VD0678
MaterialBismuth Titanate (Bi4Ti3O12)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier provider of high-purity bismuth titanate evaporation materials, alongside a diverse range of other evaporation substances. We supply these materials in both powder and granule formats, and we also offer custom options tailored to specific requirements upon request.

 

MSDS File

Bismuth Titanate Evaporation Materials Overview

TFM provides high-purity bismuth titanate evaporation materials, featuring the chemical formula Bi4Ti3O12. Our materials, with purity levels reaching up to 99.9995%, are essential for ensuring superior quality in deposited films. TFM employs rigorous quality assurance processes to maintain the reliability and excellence of our products.

Applications of Bismuth Titanate Evaporation Materials

Our bismuth titanate materials are versatile and are utilized in several key applications:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Uses: Suitable for wear protection, decorative coatings, and various display technologies.

Packaging and Handling

We ensure that our bismuth titanate evaporation materials are meticulously labeled and tagged to facilitate easy identification and quality control. Special attention is given to packaging to prevent any damage during storage and transit.

Contact Us

As a leading manufacturer of high-purity bismuth titanate evaporation materials, TFM offers a range of formats including tablets, granules, rods, and wires. We also provide custom shapes and quantities to meet specific needs. In addition, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about other materials not listed, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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