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ST0139 Bismuth Titanate Sputtering Target, Bi4Ti3O12

Chemical Formula: Bi4Ti3O12
Catalog Number: ST0139
CAS Number: 12010-77-4
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Bismuth Titanate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Bismuth Titanate Sputtering Target Description

The Bismuth Titanate Sputtering Target from TFM is an advanced oxide sputtering material with the chemical formula Bi4Ti3O12. This material is known for its excellent ferroelectric and piezoelectric properties, making it highly suitable for a range of high-performance applications.

BismuthBismuth is a chemical element whose name originates from the German word ‘Bisemutum,’ a corruption of ‘Weisse Masse,’ meaning white mass. It was first used in 1753 and discovered by C.F. Geoffroy. The chemical symbol for bismuth is “Bi,” and its atomic number is 83. Bismuth is located in Period 6, Group 15 of the periodic table, within the p-block. Its relative atomic mass is 208.98040(1) Dalton, with the number in brackets indicating the measurement uncertainty. Bismuth is known for its low toxicity compared to other heavy metals, making it useful in various applications.

Related Product: Bismuth (Bi) Sputtering Target

TitaniumTitanium is a chemical element named after the Titans, the sons of the Earth goddess in Greek mythology. It was first mentioned in 1791 and observed by W. Gregor. The isolation was later accomplished and announced by J. Berzelius. The chemical symbol for titanium is “Ti,” and its atomic number is 22. Titanium is located in Period 4, Group 4 of the periodic table, belonging to the d-block. Its relative atomic mass is 47.867(1) Dalton, with the number in brackets indicating the measurement uncertainty. Titanium is known for its high strength-to-weight ratio and excellent corrosion resistance, making it valuable in aerospace, medical, and industrial applications.

Related Product: Titanium (Ti) Sputtering Target

OxygenOxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty. Oxygen is essential for respiration in most life forms and plays a critical role in combustion and various chemical reactions.

Bismuth Titanate Sputtering Target Handling Notes

  • Indium Bonding: Indium bonding is recommended for the Bi4Ti3O12 sputtering target due to its brittleness and low thermal conductivity, which make it less suitable for traditional sputtering methods.
  • Thermal Conductivity: This material has low thermal conductivity and is susceptible to thermal shock. Proper handling and bonding are essential to avoid damage during the sputtering process.

Bismuth Titanate Sputtering Target Application

The Bismuth Titanate Sputtering Target is utilized in a variety of applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also essential for functional coatings, the optical information storage industry, glass coatings for automotive and architectural glass, and optical communication systems, among other fields.

Bismuth Titanate Sputtering Target Packing

Our Bismuth Titanate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

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TFM offers Bismuth Titanate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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