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VD0748 Boron Nitride Evaporation Materials, BN

Catalog No.VD0748
MaterialBoron Nitride (BN)
Purity99.5%
ShapePowder/ Granule/ Custom-made

At TFM, we excel in providing top-quality Boron Nitride evaporation materials and a diverse selection of other evaporation substances. Our product range includes both powder and granule forms of these materials. For those with specific needs, we also offer customized solutions to meet unique requirements.

MSDS File

Boron Nitride Evaporation Materials from TFM

Overview

TFM specializes in high-purity Boron Nitride (BN) evaporation materials, characterized by the chemical formula BN. These nitride ceramic materials are essential for achieving high-quality film deposition. Our BN evaporation materials feature a purity of up to 99.9995%, ensuring top-notch performance and reliability through stringent quality assurance measures.

Boron Nitride Evaporation Materials Specification

Crystal StructureHexagonal
Purity> 99.5%
ResistivityInsulator
Density1.9 to 2.1 g/cm3
Poisson’s Ratio0.11
Orientation<100>,<110>,<111>
Specific Heat840 to 1610 J/kg-K
ShapePowder/ Granule/ Custom-made

Applications

Boron Nitride evaporation materials are used in various advanced applications, such as:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display applications.

Packaging

Our Boron Nitride evaporation materials are meticulously packaged to prevent damage during storage and transportation. Each package is clearly tagged and labeled to ensure efficient identification and quality control.

Contact Us

TFM is a leading provider of high-purity Boron Nitride evaporation materials. We offer various shapes, including tablets, granules, rods, and wires, with customized options available upon request. In addition to evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and further product inquiries, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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