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ST0907 Cadmium Stannate Sputtering Targets, Cd2SnO4

Chemical FormulaCd2SnO4
Catalog No.ST0907
CAS Number12185-56-7
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Cadmium Stannate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cadmium Stannate Sputtering Targets Description

Cadmium Stannate Sputtering Target is a specialized material employed in the sputter deposition process to create thin films for various applications in electronics, optics, and other industries. During sputtering, high-energy ions bombard the target material, ejecting atoms or molecules from its surface. These ejected particles then deposit onto a substrate, forming a thin film.

Cadmium Stannate (Cd₂SnO₄) is a compound composed of cadmium (Cd), tin (Sn), and oxygen (O). It is recognized for its distinctive electrical and optical properties, which make it ideal for applications in transparent conductive films.

Related Product: Cadmium Selenide Sputtering Target, Cadmium Telluride Sputtering Target, Cadmium Sputtering Target

Cadmium Stannate Sputtering Targets Specifications

Compound FormulaCd2SnO4
Molecular Weight407.49
Appearancewhite solid
Melting PointN/A
DensityN/A
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Cadmium Stannate Sputtering Targets Application

Cadmium Stannate Sputtering Target is ideal for applications involving transparent conducting films. The thin film produced using this target is both transparent and electrically conductive, making it suitable for use in transparent electrodes for displays, solar cells, and other electronic devices.

Cadmium Stannate Sputtering Targets Packaging

Our Cadmium Stannate Sputtering Targets are meticulously handled throughout storage and transportation to maintain their quality and ensure they arrive in optimal condition.

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TFM offers Cadmium Stannate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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