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ST0274 Cadmium Sulfide Sputtering Target, CdS

Chemical Formula: CdS
Catalog Number: ST0274
CAS Number: 1306-23-6
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cadmium Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Cadmium Sulfide Sputtering Target (CdS) is a critical II–VI compound semiconductor material widely used in thin-film deposition for optoelectronic and photovoltaic applications. With its direct wide bandgap and excellent optical response in the visible spectrum, CdS has long served as a benchmark buffer and window layer material in advanced semiconductor device structures. CdS sputtering targets enable precise, repeatable deposition of high-quality CdS thin films under controlled PVD conditions.

Detailed Description

CdS sputtering targets are manufactured from high-purity cadmium sulfide powders synthesized with strict stoichiometric control. The powders are consolidated through carefully optimized pressing and sintering processes to achieve high density, uniform microstructure, and stable sputtering performance. These characteristics are essential for minimizing arcing, particle generation, and compositional deviation during deposition.

Compared with reactive sputtering approaches, using a compound CdS target allows direct film formation without introducing additional sulfur-containing gases, significantly simplifying process control and improving film reproducibility. CdS targets are typically operated under RF sputtering due to their semiconducting nature, enabling smooth plasma stability and uniform erosion profiles.

CdS thin films deposited from sputtering targets exhibit strong optical absorption near the band edge, high transparency in the visible region (when properly controlled), and excellent interface compatibility with absorber materials such as CdTe and CIGS. These properties make CdS targets indispensable in both industrial-scale production and research-level device optimization.

Applications

Cadmium Sulfide sputtering targets are commonly used in:

  • Thin-film solar cells: Buffer and window layers in CdTe and CIGS photovoltaic devices

  • Optoelectronics: Photodetectors, photoconductors, and light-sensitive devices

  • Semiconductor research: Wide bandgap semiconductor and heterojunction studies

  • Optical coatings: Controlled absorption and transmission layers

  • Thin-film sensors: Gas, light, and radiation-sensitive coatings

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionCdS (Cadmium Sulfide)Defines bandgap and optical response
Purity99.99% – 99.999%Ensures low defect density in films
StoichiometryCd:S ≈ 1:1Maintains electrical and optical stability
Diameter25 – 300 mm (custom)Compatible with standard sputtering cathodes
Thickness3 – 6 mm (typical)Influences target lifetime
Density≥ 95% of theoreticalSupports stable sputtering behavior
BondingIndium / Elastomer / DirectImproves heat dissipation and mechanical integrity

Comparison with Related Materials

MaterialKey AdvantageTypical Application
CdSIdeal bandgap for buffer layersCdTe & CIGS solar cells
ZnSCadmium-free alternativeOptical and eco-sensitive devices
ZnOHigh transparency, conductivityTCO and window layers
CdSeNarrower bandgapPhotodetectors and optoelectronics

FAQ

QuestionAnswer
Can CdS sputtering targets be customized?Yes, size, purity, density, and bonding can be tailored.
Is RF sputtering required for CdS?RF sputtering is typically recommended due to CdS’s semiconducting nature.
How is cadmium safety handled?Targets are sealed and handled under strict safety and compliance procedures.
How are CdS targets packaged?Vacuum-sealed with moisture- and contamination-resistant protection.

Packaging

Our Cadmium Sulfide Sputtering Targets (CdS) are carefully labeled and vacuum-sealed to ensure traceability and consistent quality control. Protective cushioning and export-grade packaging are used to prevent mechanical damage and contamination during storage and international transportation.

Conclusion

Cadmium Sulfide Sputtering Target (CdS) remains a cornerstone material for high-performance thin-film photovoltaics and optoelectronic devices. With controlled stoichiometry, stable sputtering behavior, and customizable configurations, CdS targets provide a reliable solution for both production-scale manufacturing and advanced research applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Related Product: Cadmium Sputtering Target

 

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CdS Target 99.9% ø4"×3mm Indium Bonded 3mm Cu B/Plate, CdS target 4N Density>97% ø76.2×6.35mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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