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Cadmium Telluride Evaporation Materials

VD0859 Cadmium Telluride Evaporation Materials, CdTe

Catalog No.VD0859
MaterialCadmium Telluride (CdTe)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity cadmium telluride evaporation materials. Our comprehensive range includes both powder and granule forms of evaporation materials to meet diverse needs. For those with specific requirements, we also provide customized forms tailored to your specifications.

MSDS File

Cadmium Telluride Evaporation Materials Overview

Cadmium telluride (CdTe) evaporation materials from TFM are high-purity telluride ceramics crucial for achieving superior film quality in deposition processes. Our CdTe materials, available with purities up to 99.9995%, are meticulously manufactured to ensure exceptional reliability and performance.

Product Specifications

Material TypeCadmium Telluride
SymbolCdTe
Appearance/ColorGrey solid
Melting Point1,041 °C (1,906 °F; 1,314 K)
Density5.85 g·cm−3
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

Applications

Cadmium telluride evaporation materials are essential for a variety of deposition techniques, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). These materials are widely used in optics for applications such as wear protection, decorative coatings, and display technologies.

Packaging and Quality Assurance

Our CdTe evaporation pellets are packaged in plastic vacuum bags to maintain product integrity during storage and shipping. Each package includes a Certificate of Analysis (COA) to verify the quality and purity of the material.

Contact Us

At TFM, we are dedicated to providing high-quality cadmium telluride evaporation materials for advanced semiconductor, CVD, PVD, and optical applications. Our expert team combines engineering, manufacturing, and analytical expertise to deliver top-tier products. For inquiries or more information, please reach out to us today.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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