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ST0236 Calcium Fluoride Sputtering Target, CaF2

Chemical Formula: CaF2
Catalog Number: ST0236
CAS Number: 7789-75-5
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Calcium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Calcium Fluoride Sputteri Fluoride Sputtering Target Description

Calcium fluoride sputtering target from TFM is a fluoride ceramic sputtering material with the formula CaF2.

CalciumCalcium is a chemical element derived from the Latin word ‘calx,’ meaning lime. It was first mentioned and observed by Humphry Davy in 1808, who also accomplished its isolation. The chemical symbol for calcium is “Ca.” It is located in Period 4, Group 2 of the periodic table, belonging to the s-block. The atomic number of calcium is 20, and its relative atomic mass is approximately 40.078(4) Dalton, with the number in parentheses indicating the uncertainty.

Related Product: Calcium Sputtering Target

FluorineFluorine, sometimes called fluorin, is a chemical element with its name derived from the Latin word ‘fluere,’ meaning “to flow.” It was first identified in 1810 by André-Marie Ampère, and its isolation was achieved and announced by Henri Moissan. The chemical symbol for fluorine is “F.” It is positioned in Period 2, Group 17 of the periodic table, which is part of the p-block. The atomic number of fluorine is 9, and its relative atomic mass is approximately 18.9984032(5) Dalton, with the number in parentheses indicating the uncertainty in the measurement.

Calcium Fluoride Sputtering Target Specification

Compound FormulaCaF2
Molecular Weight78.07
AppearanceSolid
Melting Point1370 °C
Boiling PointN/A
Density3.2 g/cm3

Calcium Fluoride Sputtering Target Packaging

Our calcium fluoride sputtering target is meticulously tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage that might occur during storage or transportation, thereby preserving the product’s quality and integrity.

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TFM offers Calcium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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