Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
dewatermark-ai_1722479294129-removebg-preview

ST0275 Calcium Sulfide Sputtering Target, CaS

Chemical Formula: CaS
Catalog Number: ST0275
CAS Number: 20548-54-3
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Calcium Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Calcium Sulfide Sputtering Target Description

The calcium sulfide sputtering target is a ceramic sputtering material made up of calcium and sulfur. This material is commonly used in various industrial applications, particularly in thin film deposition processes. It is utilized in the production of coatings for semiconductor, display, LED, and photovoltaic devices, as well as for decorative and functional coatings in the optical information storage space industry, glass coating industry, including automotive and architectural glass, and optical communication systems.

CalciumCalcium is a chemical element that derives its name from the Latin word ‘calx’, meaning lime. It was first mentioned in 1808 by Humphry Davy, who also achieved its isolation and announced it later that year. Represented by the symbol “Ca”, calcium has an atomic number of 20 and is situated in Period 4 and Group 2 of the periodic table, making it part of the s-block elements. The relative atomic mass of calcium is 40.078(4) Dalton, with the number in brackets indicating the measurement uncertainty.

Related Product: Calcium Sputtering Target

SulfurSulfur, also known as sulphur, is a chemical element with the symbol “S” and atomic number 16. It derives its name either from the Sanskrit word ‘sulvere’ or the Latin word ‘sulfurium’, both of which refer to sulfur. This element has been known and used since before 2000 BC, with early uses recorded by Chinese and Indian civilizations. Sulfur is located in Period 3 and Group 16 of the periodic table, making it part of the p-block. The relative atomic mass of sulfur is 32.065(5) Dalton, with the number in brackets indicating the uncertainty of this measurement.

Calcium Sulfide Sputtering Target Specification

Compound FormulaCaS
AppearanceWhite to off-white target
Density4.82 g/cm3
Melting Point2.5 g/cm3
Molecular Weight72.14
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Calcium Sulfide Sputtering Target Application

The calcium sulfide sputtering target is utilized in a variety of applications, including thin film deposition for semiconductor, display, and LED technologies. It is also used in photovoltaic devices, functional coatings, and optical information storage industries. Additionally, calcium sulfide is applied in glass coating processes, particularly for automotive glass and architectural glass, as well as in optical communication systems. This material’s versatility makes it valuable in industries requiring durable and efficient coating solutions.

Calcium Sulfide Sputtering Target Packing

Our calcium sulfide sputter targets are meticulously tagged and labeled externally to facilitate efficient identification and maintain quality control. We take extensive precautions during handling and packaging to prevent any potential damage during storage or transportation, ensuring that the products arrive in optimal condition.

Get Contact

TFM offers Calcium Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0275 Calcium Sulfide Sputtering Target, CaS”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top