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ST0007C Calcium Titanate Sputtering Targets

Introduction

Calcium Titanate Sputtering Targets (CaTiO₃) are high-performance ceramic targets used for depositing functional oxide thin films in electronic, optical, and energy-related applications. Calcium titanate is a perovskite-structured oxide material known for its excellent dielectric properties, chemical stability, and compatibility with complex oxide thin film systems.

When used in magnetron sputtering or other physical vapor deposition (PVD) processes, CaTiO₃ sputtering targets enable the formation of high-quality thin films with controlled composition and microstructure. These films are widely used in dielectric layers, microwave devices, electronic ceramics, and advanced oxide electronics research.

Detailed Description

Calcium Titanate sputtering targets are manufactured using high-purity calcium oxide (CaO) or calcium carbonate precursors combined with titanium dioxide (TiO₂). Through controlled ceramic processing techniques—including powder synthesis, calcination, pressing, and high-temperature sintering—CaTiO₃ ceramic targets with high density and uniform composition are produced.

CaTiO₃ belongs to the perovskite family of oxide materials, which exhibit unique electrical, dielectric, and structural properties. These characteristics make calcium titanate particularly suitable for thin film applications in electronic and microwave components.

One of the key advantages of CaTiO₃ is its stable dielectric constant and low dielectric loss, which are important for high-frequency electronic devices. Additionally, calcium titanate exhibits strong chemical stability and good thermal resistance, allowing it to perform reliably in demanding deposition environments.

High-density CaTiO₃ sputtering targets help maintain stable sputtering rates, consistent film composition, and minimal particle generation during deposition. For large-area sputtering systems or high-power deposition processes, the ceramic target may also be supplied as a bonded target with a copper backing plate, typically using indium bonding for improved heat dissipation.

Applications

Calcium Titanate sputtering targets are widely used in advanced electronic and functional thin film technologies:

  • Dielectric thin films for capacitors and electronic devices

  • Microwave dielectric materials used in communication systems

  • Perovskite oxide thin film research

  • Functional oxide coatings for electronic components

  • Energy-related materials research

  • Advanced ceramic electronics and sensors

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaCaTiO₃Determines perovskite crystal structure
Purity≥ 99.9%Ensures stable dielectric and electronic properties
Diameter25 – 300 mm (custom)Compatible with standard sputtering systems
Thickness3 – 6 mmInfluences sputtering stability and target lifetime
Density≥ 95% theoretical densityEnsures uniform film deposition
BondingCopper backing plate / Indium bondedImproves heat dissipation during sputtering

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Calcium Titanate (CaTiO₃)Stable dielectric properties and perovskite structureMicrowave and electronic ceramics
Barium Titanate (BaTiO₃)High dielectric constantCapacitors and ferroelectric devices
Strontium Titanate (SrTiO₃)Excellent lattice matching for oxide filmsSubstrates and electronic devices

FAQ

QuestionAnswer
What sputtering methods are suitable for CaTiO₃ targets?Calcium titanate targets are typically used in RF magnetron sputtering systems designed for ceramic materials.
Can the target size be customized?Yes. Diameter, thickness, and bonding configurations can be customized according to system requirements.
Are bonded sputtering targets available?Yes. CaTiO₃ ceramic targets can be bonded to copper backing plates to improve thermal conductivity and stability during sputtering.
What substrates are suitable for CaTiO₃ thin films?Films can be deposited on silicon wafers, glass, ceramic substrates, and other oxide materials.
What industries commonly use CaTiO₃ sputtering targets?Electronics manufacturing, microwave device production, functional oxide research, and advanced materials development.

Packaging

Our Calcium Titanate Sputtering Targets (CaTiO₃) are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. Each target is carefully packaged in vacuum-sealed bags with protective foam and export-grade cartons or wooden crates to prevent contamination and mechanical damage during storage and transportation.

Conclusion

Calcium Titanate Sputtering Targets (CaTiO₃) provide a reliable material source for depositing high-quality perovskite oxide thin films used in dielectric devices, microwave components, and advanced electronic systems. Their stable dielectric properties, chemical durability, and compatibility with complex oxide technologies make them valuable materials in modern thin film research and manufacturing.

With high-density ceramic fabrication, customizable target sizes, and stable sputtering performance, CaTiO₃ sputtering targets support both industrial applications and cutting-edge materials science development.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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