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CdInTe4 Pellet Evaporation Material

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Introduction

CdInTe₄ pellet evaporation material is a specialized chalcogenide compound widely used in thin-film deposition for infrared, optoelectronic, and advanced semiconductor research. Thanks to its well-defined stoichiometry and favorable optical–electrical properties, CdInTe₄ is an important source material for fabricating compound semiconductor and functional thin films by thermal evaporation or electron-beam evaporation.

Detailed Description

Cadmium Indium Telluride (CdInTe₄) is a ternary telluride compound that combines the optoelectronic characteristics of cadmium telluride–based systems with indium-modified electronic behavior. When used as an evaporation material, precise compositional control is essential to ensure film uniformity and reproducibility.

Our CdInTe₄ evaporation materials are manufactured from high-purity elemental cadmium, indium, and tellurium through carefully controlled synthesis and solidification processes. The material is processed into dense, uniform pellets to ensure stable evaporation rates and minimized spitting during deposition. Pellet geometry improves handling, loading efficiency, and material utilization compared with loose powders.

CdInTe₄ pellets are suitable for vacuum thermal evaporation and e-beam evaporation systems. The controlled microstructure and purity help maintain consistent vapor composition, which is critical for producing high-quality thin films with reliable optical absorption, electrical conductivity, and compositional uniformity. These materials are commonly used in research environments where precise film characteristics are required.

Applications

CdInTe₄ pellet evaporation materials are primarily used in:

  • Infrared and optoelectronic thin films

  • Compound semiconductor research and development

  • Photodetectors and sensor materials

  • Thin-film photovoltaic and photoactive layers

  • Chalcogenide semiconductor studies

  • Academic and industrial thin-film R&D

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialCdInTe₄Determines optical & electronic properties
Purity99.9% – 99.99%Reduces contamination in deposited films
FormPelletEnsures stable and clean evaporation
Pellet Size1–6 mm (custom available)Compatible with various crucibles
Deposition MethodThermal / E-beam evaporationMatches standard vacuum systems
Moisture SensitivityControlled handling requiredMaintains material integrity

Comparison with Related Materials

MaterialKey AdvantageTypical Application
CdInTe₄Tuned optoelectronic propertiesIR & semiconductor thin films
CdTeMature material systemPhotovoltaics, detectors
InTeNarrow bandgapSpecialized electronic films
ZnTeWide bandgapOptoelectronic coatings

FAQ

QuestionAnswer
Are CdInTe₄ pellets suitable for e-beam evaporation?Yes, they are compatible with both thermal and e-beam evaporation systems.
Can pellet size be customized?Yes, pellet dimensions can be tailored to your crucible or source design.
How is purity controlled?High-purity raw materials and controlled synthesis are used.
What packaging is used?Vacuum-sealed or inert-gas packaging to prevent oxidation and moisture uptake.
Is this material mainly for research use?Yes, it is commonly used in R&D and pilot-scale thin-film development.

Packaging

Our CdInTe₄ Pellet Evaporation Material is carefully labeled for full traceability and quality control. The pellets are vacuum-sealed or packed under inert atmosphere and protected with shock-absorbing materials to prevent contamination or damage during storage and transportation.

Conclusion

CdInTe₄ pellet evaporation material offers reliable composition, stable evaporation behavior, and high purity for advanced thin-film deposition. Its pellet form ensures ease of handling and consistent film quality, making it a dependable choice for optoelectronic and semiconductor research applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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