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CdInTe4 Pellet Evaporation Material

MSDS File
Material TypeCdInTe4
SymbolCdInTe4
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

CdInTe4 Pellet Evaporation Material

TFM provides high-purity CdInTe4 Pellet Evaporation Material, a key compound for thin-film solar cells, optoelectronic devices, and semiconductor applications. With its excellent optical and electrical properties, CdInTe4 is widely utilized in photovoltaics and advanced material research.

Key Features and Advantages

  • High Purity (99.99% – 99.999%) – Ensures superior performance in thin-film deposition.

  • Optimized for Thin-Film Deposition – Suitable for thermal evaporation and E-beam evaporation techniques.

  • Enhanced Optical & Electrical Properties – Provides high absorption efficiency for solar energy applications.

  • Stable & Uniform Film Formation – Ensures consistent coating quality, essential for optoelectronic and semiconductor devices.

  • Customizable Composition – The Cd/In/Te ratio can be tailored to meet specific research and industrial requirements.

Applications

  • Thin-Film Solar Cells – Enhances photovoltaic efficiency in next-generation solar panels.

  • Optoelectronic Devices – Used in infrared detectors, photodetectors, and LEDs.

  • Semiconductor Research & Development – Supports new material exploration for advanced electronics.

  • Thin-Film Transistors & Sensors – Applied in wearable and transparent electronics.

Industry Impact

TFM’s CdInTe4 Pellet Evaporation Material is a high-performance material for solar energy and optoelectronic applications. With its high purity, superior absorption capabilities, and optimized thin-film deposition characteristics, it is a valuable choice for semiconductor research, renewable energy, and advanced device fabrication.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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