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Cerium Hexaboride​ Evaporation Materials

VD0830 Cerium Hexaboride​ Evaporation Materials, CeB6

Catalog No.VD0830
MaterialCerium Boride (CeB6)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier specializing in high-purity cerium hexaboride (CeB₆) evaporation materials. Our extensive range includes various evaporation materials available in both powder and granule forms. We also offer customized forms to meet specific requirements, ensuring that you get the exact product you need for your applications.

MSDS File

Cerium Hexaboride Evaporation Materials Overview

Cerium hexaboride (CeB₆) is a high-purity boride ceramic used extensively in evaporation processes to create high-quality deposited films. This material is integral to various deposition technologies, including semiconductor fabrication and thin-film coating processes. At TFM, we provide cerium hexaboride evaporation materials with exceptional purity, reaching up to 99.9995%, ensuring reliable and consistent performance.

Specifications

Material TypeCerium Hexaboride
SymbolCeB6
Appearance/ColorBlue
Melting Point2,552 °C; 4,625 °F; 2,825 K
Density4.80 g/cm3
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications

Cerium hexaboride evaporation materials are crucial in various deposition techniques such as:

  • Semiconductor Deposition: Essential for high-precision applications in electronics.
  • Chemical Vapor Deposition (CVD): Used for creating thin, high-quality films.
  • Physical Vapor Deposition (PVD): Ideal for coating substrates with protective or decorative layers.

These materials are commonly used in optics for:

  • Wear Protection
  • Decorative Coatings
  • Display Technologies

Packaging and Handling

Our cerium hexaboride materials are carefully packaged to prevent damage during storage and transportation. Each package is clearly labeled to facilitate efficient handling and quality control.

Contact Us

TFM is a trusted provider of high-purity cerium hexaboride evaporation materials. We offer a range of forms including tablets, granules, rods, and wires, with custom sizes and quantities available upon request. We also supply various evaporation accessories such as sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about additional materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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