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Cerium Sputtering Target, Ce

Chemical Formula: Ce
Catalog Number: TFM-SPT-0110
CAS Number: 7440-45-1
Purity: >99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cerium Sputtering Targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

CoA_Ce_TRG

Product Overview

Cerium Sputtering Target (Ce) is a conductive sputtering target used to deposit elemental thin films where purity, film cleanliness, and stable metallic sputtering behavior are important. For thin-film applications, the practical selection criteria are not limited to the target chemistry alone: purity grade, target density, dimensions, grain structure, surface finish, and backing configuration can all influence process stability and film quality.


Cerium

Material and Deposition Characteristics

Because the target is electrically conductive, DC magnetron sputtering is often applicable, although pulsed-DC or other power modes may also be used depending on the deposition system and film target. For high-specification films, target grain structure, residual stress, and surface preparation can influence erosion uniformity and the morphology of the deposited layer. When higher power loading or system-specific mounting is involved, a bonded target assembly may also be considered.

Technical Data

Material TypeCerium
SymbolCe
Color/AppearanceSilvery White, Metallic
Melting Point798°C
Density~6.70g/cc
Thermal Conductivity1 W/m.K
Coefficient of Thermal Expansion6.3 x 10-6/K
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Typical Thin-Film Applications

  • Cerium thin films for conductive, optical, catalytic, or functional coating development
  • Semiconductor, energy, electronic, or laboratory PVD research depending on the element
  • Projects requiring a pure elemental source in planar or custom target geometry

Target Configuration and Ordering Considerations

For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.

Frequently Asked Questions

Can Cerium sputtering targets be used with DC magnetron sputtering?

Yes. Conductive metallic targets are commonly processed with DC magnetron sputtering, although pulsed-DC or other modes may also be used depending on the equipment and film objective.

What purity grade should I choose for a Cerium target?

The required purity should be selected from the contamination limits and performance needs of the deposited film. Higher purity can reduce unwanted impurities, but the optimum grade should match the application rather than default to the highest available level.

Why do density and microstructure matter for Cerium targets?

Target density, grain structure, and residual stress can influence erosion behavior, process stability, and the morphology of the deposited film. These factors become more important as film-quality requirements become tighter.

Can a Cerium target be bonded to a copper backing plate?

Yes. A bonded assembly may be used when the cathode design requires a backing plate or when improved support and heat transfer are desirable. The bonding method should be matched to target thickness and operating conditions.

What are common applications of sputtered Cerium films?

Typical uses include conductive layers, metallization, reflective or protective coatings, and composition-specific PVD research. The exact application depends on the properties of the element and the final film stack.

What information should I send TFM for a custom Cerium target?

Please provide target dimensions, thickness, purity, quantity, target style, backing-plate requirement, cathode model if known, and any tolerance, surface-finish, inspection, or documentation requirements.

Order Now

Ce 3N ø50.8*3.18mm, Ce 3N ø50.8*3mm, Ce 3N ø50.8*6mm, Ce 3N ø76.2×6.0mm, Ce Target 3N ø92×4mm, Brazed to ø100×4mm Cu Backing Plate, Ce target 3N ø50.8×6.35 mm, Ce Rod 3N Ø2 mm × L50 mm, Ce Target 3N Ø2"×6.35 mm, Ce Sheet 3N 20×20 mm × 0.25 mm, Ce Sheet 3N 20×20 mm × 0.5 mm, Ce TRG 3N, Ø2″×6.35 mm, Ce TRG 99.9%, ø4″×6 mm, Ce Foil 3N 0.2×100×100mm 1/5pcs, Ce TRG 2N Ø200×6mm, Ø1" × 1 mm, Cerium (Ce), 3N

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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