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CF Flanged Quartz (Fused Silica) Laser Transmission Viewports

Key Attributes of CF Flanged Quartz (Fused Silica) Laser Transmission Viewports:

  • Constructed from superior-grade materials adhering to Ultra-High Vacuum (UHV) standards.
  • Designed for compatibility with vacuum systems capable of achieving UHV conditions.
  • Optics and coatings optimized for compatibility with common laser wavelengths.
  • Sealed using fully annealed copper gaskets to minimize stress and strain.
  • In instances where material deposition is possible, we highly recommend the use of a viewport shutter to prevent damage and maintain the optical quality of the lens.

Ordering Table

Drawing Flange / Mounting Window Material Wavelength Optimization Reflection (avg) View Area Window Thickness Flange Material Sleeve Material PartNumber
Tooltip DN16CF (1.33" OD) Corning HPFS 7980 Fused Silica 780nm <0.25% Per Surface 0.63 0.085 304L SS 304L SS VPZL-133LDIO
Tooltip DN16CF (1.33" OD) Corning HPFS 7980 Fused Silica 808nm <0.25% Per Surface 0.63 0.085 304L SS 304L SS VPZL-133LDIO3
Tooltip DN16CF (1.33" OD) Corning HPFS 7980 Fused Silica 1064nm <0.25% Per Surface 0.63 0.085 304L SS 304L SS VPZL-133LYAG
Tooltip DN16CF (1.33" OD) Corning HPFS 7980 Fused Silica 780nm and 1064nm <0.25% Per Surface 0.63 0.085 304L SS 304L SS VPZL-133LYAGD2
Tooltip DN35CF-DN40CF (2.75" OD) Corning HPFS 7980 Fused Silica Excimer Grade 193 193nm <0.25% Per Surface 1.40 0.125 304L SS 304L SS VPZL-275LARF
Tooltip DN35CF-DN40CF (2.75" OD) Corning HPFS 7980 Fused Silica 780nm <0.25% Per Surface 1.40 0.125 304L SS 304L SS VPZL-275LDIO
Tooltip DN35CF-DN40CF (2.75" OD) Corning HPFS 7980 Fused Silica 1550nm <0.25% Per Surface 1.40 0.125 304L SS 304L SS VPZL-275LDIO2
Tooltip DN35CF-DN40CF (2.75" OD) Corning HPFS 7980 Fused Silica 808nm <0.25% Per Surface 1.40 0.125 304L SS 304L SS VPZL-275LDIO3
Tooltip DN35CF-DN40CF (2.75" OD) Corning HPFS 7980 Fused Silica Excimer Grade 248 248nm <0.25% Per Surface 1.40 0.125 304L SS 304L SS VPZL-275LKRF
Tooltip DN35CF-DN40CF (2.75" OD) Corning HPFS 7980 Fused Silica 1064nm <0.25% Per Surface 1.40 0.125 304L SS 304L SS VPZL-275LYAG
Tooltip DN35CF-DN40CF (2.75" OD) Corning HPFS 7980 Fused Silica 355nm <0.25% Per Surface 1.40 0.125 304L SS 304L SS VPZL-275LYAG3
Tooltip DN35CF-DN40CF (2.75" OD) Corning HPFS 7980 Fused Silica 532nm and 1064nm <0.25% Per Surface 1.40 0.125 304L SS 304L SS VPZL-275LYAGD1
Tooltip DN35CF-DN40CF (2.75" OD) Corning HPFS 7980 Fused Silica 780nm and 1064nm <0.25% Per Surface 1.40 0.125 304L SS 304L SS VPZL-275LYAGD2
Tooltip DN63CF (4.50" OD) Corning HPFS 7980 Fused Silica Excimer Grade 193 193nm <0.25% Per Surface 2.69 0.250 304L SS 304L SS VPZL-450LARF
Tooltip DN63CF (4.50" OD) Corning HPFS 7980 Fused Silica 780nm <0.25% Per Surface 2.69 0.250 304L SS 304L SS VPZL-450LDIO
Tooltip DN63CF (4.50" OD) Corning HPFS 7980 Fused Silica 1550nm <0.25% Per Surface 2.69 0.250 304L SS 304L SS VPZL-450LDIO2
Tooltip DN63CF (4.50" OD) Corning HPFS 7980 Fused Silica Excimer Grade 248 248nm <0.25% Per Surface 2.69 0.250 304L SS 304L SS VPZL-450LKRF
Tooltip DN63CF (4.50" OD) Corning HPFS 7980 Fused Silica 1064nm <0.25% Per Surface 2.69 0.250 304L SS 304L SS VPZL-450LYAG
DN63CF (4.50" OD) Corning HPFS 7980 Fused Silica 532nm <0.25% Per Surface 2.69 0.250 304L SS 304L SS VPZL-450LYAG2
Tooltip DN63CF (4.50" OD) Corning HPFS 7980 Fused Silica 532nm and 1064nm <0.25% Per Surface 2.69 0.250 304L SS 304L SS VPZL-450LYAGD1

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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