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Chromium Antimonide (CrSb) Sputtering Target

Chromium Antimonide (CrSb) Sputtering Target Description

Chromium Antimonide (CrSb) Sputtering Targets are high-purity intermetallic materials engineered for precision thin film deposition in advanced magnetic, spintronic, and semiconductor applications. With a stoichiometric atomic ratio of 1:1 and purity up to 99.99%, CrSb targets deliver reliable performance in research and industry environments requiring stable magnetic and electronic properties.

Material Overview: What is CrSb?

CrSb is a binary compound composed of chromium (Cr) and antimony (Sb) in a 1:1 atomic ratio. It crystallizes in a NiAs-type hexagonal structure, exhibiting robust antiferromagnetic or ferromagnetic behavior depending on the growth conditions and temperature. Its unique combination of electronic and magnetic properties makes it a promising material for next-generation devices.

Chromium Antimonide Sputtering Target Specifications

PropertyValue
Chemical FormulaCrSb
Composition1:1 atomic ratio (Cr:Sb)
Purity99.99% (4N)
AppearanceMetallic gray to black, solid
Target DiameterØ50.8 mm (2 inches)
Target Thickness3 mm
Backing PlateCopper (Cu), 2 mm thickness
Bonding MethodIndium bonding (standard) or custom on request
PackagingCleanroom-sealed under inert atmosphere

CrSb Sputtering Target Applications

1. Spintronics and Magnetic Thin Films

CrSb is considered a half-metallic ferromagnet, meaning it can conduct electrons of one spin orientation while acting as an insulator for the opposite spin. This property is highly valuable in spintronic devices such as magnetic tunnel junctions (MTJs), GMR sensors, and spin transistors.

2. Semiconductor Research

Due to its narrow band gap and tunable carrier density, CrSb is of interest in developing magnetic semiconductors, topological materials, and quantum computing devices.

3. Magnetic Data Storage

CrSb films are being explored for high-density storage media, where spin-aligned materials enable faster and more stable data processing and retention.

4. Fundamental Material Science

CrSb sputtering targets are widely used in laboratories to study magnetotransport, crystal growth, and phase transition behaviors of intermetallic magnetic compounds.

Key Advantages of CrSb Sputtering Targets

  • High Purity (99.99%) ensures contamination-free deposition for research-grade films.

  • Excellent Magnetic Properties, suitable for spintronic and magnetic device fabrication.

  • Stable Thin Film Formation under various deposition techniques such as RF/DC magnetron sputtering and pulsed laser deposition.

  • Custom Sizes and Bonding Options available to meet specific system requirements.

Customization and Support

TFM offers Chromium Antimonide Sputtering Targets in a variety of sizes, thicknesses, and bonding configurations. Whether you’re exploring spintronic mechanisms or manufacturing prototype devices, our team can provide tailored CrSb solutions to match your equipment and project goals.

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CrSb Target 1:1 at% 99.99% ø50.8×3mm Cu B/Plate 2mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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