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ST0292 Chromium Boride Sputtering Target, CrB2

Chemical Formula: CrB2
Catalog Number: ST0292
CAS Number: 12007-16-8
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium Boride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Chromium Boride Sputtering Target Description

A Chromium Boride Sputtering Target is a type of ceramic material consisting of chromium and boron. It is commonly used in sputtering processes for thin film deposition, owing to its specific properties and composition.

Chromium

Chromium is a chemical element with the symbol “Cr” and an atomic number of 24. The name “chromium” is derived from the Greek word ‘chroma,’ meaning color, due to the various colored compounds it forms. It was discovered in 1797 by the French chemist Louis-Nicolas Vauquelin, who isolated it from the mineral crocoite. Chromium is located in Period 4 and Group 6 of the periodic table, belonging to the d-block elements. The relative atomic mass of chromium is approximately 51.9961 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Chromium Sputtering Target

BoronBoron, symbolized as “B” with an atomic number of 5, is a chemical element named after the Arabic word ‘buraq,’ which referred to borax. It was first identified in 1808 by scientists Louis-Joseph Gay-Lussac and Louis-Jacques Thénard. The successful isolation of boron was later achieved and announced by Sir Humphry Davy. Boron is found in Period 2 and Group 13 of the periodic table, classified within the p-block elements. Its relative atomic mass is approximately 10.811 Daltons, with the value in parentheses indicating a margin of uncertainty.

Related Product: Boron Sputtering Target

Chromium Boride Sputtering Target Application

The Chromium Boride Sputtering Target is employed in various applications, including thin film deposition and decorative coatings. It is widely used in the semiconductor industry, display technologies, and the production of LEDs and photovoltaic devices. Additionally, this material is essential for functional coatings, optical information storage, and glass coating industries, such as automotive and architectural glass. It is also utilized in optical communication technologies.

Chromium Boride Sputtering Target Packing

Our Chromium Boride Sputtering Targets are carefully tagged and labeled externally to ensure easy identification and maintain rigorous quality control standards. We take extensive measures to prevent damage during storage and transportation, ensuring the targets remain in optimal condition.

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TFM offers Chromium Boride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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