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Chromium Boride Sputtering Target

ST0924 Chromium Boride Sputtering Target, Cr5B3

Chemical FormulaCr5B3
Catalog No.ST0924
CAS Number12007-38-4
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Chromium Boride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Chromium Boride Sputtering Target Description

Chromium Boride Sputtering Target is used in the sputtering process, a technique for depositing thin films onto substrates. During sputtering, high-energy ions bombard the target material, causing atoms or molecules to be ejected from its surface. These ejected particles then deposit onto a substrate, forming a thin film.

Chromium boride sputtering targets are employed in applications such as creating coatings that enhance the wear resistance of tools, increase the durability of surfaces, or impart specific optical or electrical properties.

Related Product: Chromium Boride Sputtering Target

Chromium Boride Sputtering Target Specifications

Compound FormulaCr5B3
Molecular Weight292.41
AppearanceGray target
Melting Point1900
Density (g/cm3)6.1
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Chromium Boride Sputtering Target Handling Notes

Indium bonding is recommended for Chromium Boride Sputtering Targets due to the material’s characteristics that may not be suitable for sputtering on its own. These characteristics include brittleness and low thermal conductivity. Chromium boride has a low thermal conductivity and is susceptible to thermal shock, making indium bonding a preferable method to ensure stable and efficient sputtering performance.

Chromium Boride Sputtering Target Application

Chromium Boride Sputtering Targets are widely used in various applications, including photovoltaic, thermoelectric, and optoelectronic devices.

Chromium Boride Sputtering Target Packaging

Our Chromium Boride Sputtering Target is widely used in the production of coatings to improve wear resistance, enhance surface durability, and provide specific optical or electrical properties.

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TFM offers Chromium Boride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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