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Chromium-doped Silicon Monoxide Sputtering Target

ST0187 Chromium-doped Silicon Monoxide Sputtering Target, SiO/Cr

Chemical Formula: SiO/Cr
Catalog Number: ST0187
CAS Number: 7440-47-3 | 1009
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

chromium-doped silicon monoxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Chromium-doped Silicon Monoxide Sputtering Target (SiO/Cr) is a functional composite target developed for thin-film applications that require enhanced film stability, controlled electrical behavior, and improved adhesion compared with conventional silicon monoxide coatings. By introducing a controlled amount of chromium into the SiO matrix, this material enables advanced optical, electronic, and protective coatings with tailored performance.

SiO/Cr sputtering targets are widely used in optical coating systems, microelectronics research, and functional thin-film development where precise compositional control and repeatable deposition behavior are essential.

Detailed Description

Chromium-doped Silicon Monoxide sputtering targets are produced using high-purity silicon monoxide and chromium raw materials through carefully controlled powder blending, consolidation, and sintering processes. The resulting target exhibits uniform chromium distribution, high density, and stable microstructure—key factors for consistent sputtering rates and film composition.

In thin-film deposition, chromium acts as an effective dopant that enhances film adhesion, mechanical strength, and electrical conductivity while maintaining the desirable optical characteristics of SiO. Compared with pure SiO films, SiO/Cr coatings show improved resistance to cracking, delamination, and environmental degradation, especially in multilayer optical stacks or demanding device environments.

The SiO/Cr sputtering target is compatible with RF magnetron sputtering systems commonly used for ceramic and composite materials. Deposition parameters such as chromium content, sputtering power, oxygen partial pressure, and substrate temperature can be adjusted to fine-tune film refractive index, absorption, and electrical properties.

Applications

Chromium-doped Silicon Monoxide sputtering targets are commonly used in:

  • Optical coatings with enhanced durability

  • Adhesion-promoting interlayers in multilayer thin films

  • Thin-film resistors and functional electronic layers

  • Infrared and visible optical components

  • Protective and wear-resistant coatings

  • Research and development of doped oxide films

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionSiO with Cr dopantControls film functionality
Chromium ContentCustom (wt% or at%)Tunes electrical & mechanical properties
Purity99.9% – 99.99%Ensures film uniformity
Target Diameter25 – 300 mm (custom)Fits standard sputtering systems
Thickness3 – 6 mm (custom available)Influences sputtering stability
Density≥ 95% of theoreticalPromotes uniform erosion
Deposition MethodRF Magnetron SputteringSuitable for ceramic composites

Comparison with Related Materials

MaterialKey AdvantageTypical Application
SiO/CrImproved adhesion & stabilityOptical & functional films
Pure SiOHigh optical transparencyOptical coatings
SiO₂Chemical stabilityInsulating layers
Cr MetalStrong adhesion, conductivityAdhesion layers

FAQ

QuestionAnswer
Can the chromium content be customized?Yes, Cr concentration can be adjusted based on application needs.
Is RF sputtering required?RF sputtering is recommended due to the ceramic nature of SiO/Cr.
Can this target replace separate SiO and Cr layers?In many designs, SiO/Cr enables simplified multilayer structures.
Are small research targets available?Yes, lab-scale sizes are supported.
How is the target packaged?Vacuum-sealed with protective cushioning to prevent contamination.

Packaging

Our Chromium-doped Silicon Monoxide Sputtering Targets (SiO/Cr) are meticulously vacuum-sealed and externally labeled for efficient identification and strict quality control. Protective cushioning and moisture-resistant packaging are used to prevent mechanical damage or contamination during storage and international transportation.

Conclusion

The Chromium-doped Silicon Monoxide Sputtering Target (SiO/Cr) offers a reliable solution for depositing advanced oxide thin films with improved adhesion, durability, and tunable functional properties. With customizable composition, stable sputtering behavior, and consistent quality, SiO/Cr targets are well suited for optical, electronic, and research-driven thin-film applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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