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ST0074 Chromium Nickel Sputtering Target, Cr/Ni

Chemical Formula: Cr/Ni
Catalog Number: ST0074
CAS Number: 7440-47-3 | 7440
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Chromium Nickel sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Chromium Nickel Sputtering Target (Cr/Ni) is a versatile alloy target used in physical vapor deposition (PVD) processes to produce thin films with excellent corrosion resistance, adhesion, and mechanical durability. The combination of chromium and nickel provides a balanced set of properties, including oxidation resistance, chemical stability, and good electrical conductivity, making Cr/Ni alloy coatings valuable for semiconductor devices, decorative coatings, corrosion-resistant layers, and advanced functional films.

Cr/Ni sputtering targets are widely used in magnetron sputtering systems to deposit alloy films that offer improved durability and surface performance compared with single-element coatings.

Detailed Description

Chromium Nickel sputtering targets are manufactured from high-purity chromium and nickel using processes such as vacuum melting, powder metallurgy, or hot isostatic pressing (HIP). These methods help achieve a dense and homogeneous alloy structure, which is essential for stable sputtering performance and uniform thin film deposition.

Chromium contributes excellent hardness, corrosion resistance, and strong adhesion to a wide variety of substrates. Nickel enhances ductility, improves oxidation resistance, and stabilizes the alloy structure. Together, these elements form a robust alloy that performs well in thin film applications requiring both durability and electrical functionality.

Cr/Ni thin films are often used as adhesion layers, barrier layers, or corrosion-resistant coatings in electronic and industrial systems. The alloy composition can be customized depending on the desired film characteristics, allowing engineers to tailor properties such as hardness, conductivity, and chemical stability.

High-density Cr/Ni sputtering targets help maintain consistent sputtering rates while minimizing particle generation during deposition. For high-power sputtering systems, the targets can also be supplied with copper backing plates bonded using indium or diffusion bonding, which improves thermal conductivity and mechanical stability.

Applications

Chromium Nickel sputtering targets are used across a wide range of industrial and research applications:

  • Corrosion-resistant thin films used in protective coatings

  • Semiconductor devices requiring stable barrier or adhesion layers

  • Decorative coatings with high durability and oxidation resistance

  • Functional coatings in electronic components and sensors

  • Industrial surface treatments for improved wear resistance

  • Research laboratories studying alloy thin film materials

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures stable thin film composition
CompositionCr/Ni ratios customizable (e.g., 80/20, 70/30)Determines corrosion resistance and film properties
Diameter25 – 300 mm (custom)Compatible with most sputtering systems
Thickness3 – 6 mmInfluences sputtering efficiency and target lifetime
Density≥ 99% theoretical densityImproves deposition uniformity and stability
BondingCopper backing plate / Indium bondedEnhances heat transfer during sputtering

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Chromium Nickel (Cr/Ni)Balanced corrosion resistance and durabilityProtective and functional thin films
Chromium (Cr)High hardness and strong adhesionAdhesion layers and wear-resistant coatings
Nickel (Ni)Good corrosion resistance and electrical conductivityElectronic and electroplated coatings

FAQ

QuestionAnswer
Can the Cr/Ni composition be customized?Yes. The chromium-to-nickel ratio can be adjusted depending on the desired coating properties and application requirements.
What sputtering methods are suitable for Cr/Ni targets?Cr/Ni sputtering targets are commonly used in DC magnetron sputtering and other PVD deposition processes.
Are bonded sputtering targets available?Yes. Copper backing plates with indium bonding are often supplied to improve heat dissipation and target stability.
What purity levels are available?Standard purity levels typically range from 99.9% to 99.99%.
Can custom target sizes be manufactured?Yes. Targets can be produced in various diameters, thicknesses, and shapes to match specific sputtering systems.

Packaging

Our Chromium Nickel Sputtering Target (Cr/Ni) products are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. Each target is carefully packaged in vacuum-sealed bags with protective foam and export-grade cartons or wooden crates to prevent contamination, oxidation, and mechanical damage during storage and transportation.

Conclusion

The Chromium Nickel Sputtering Target (Cr/Ni) offers a reliable solution for depositing durable, corrosion-resistant thin films used in semiconductor devices, industrial coatings, and advanced materials research. Its balanced alloy properties provide excellent adhesion, mechanical strength, and chemical stability in demanding environments.

With customizable alloy compositions, high-density manufacturing, and consistent sputtering performance, Cr/Ni sputtering targets support a wide range of thin film technologies.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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