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VD0749 Chromium Nitride Evaporation Materials, CrN

Catalog No.VD0749
MaterialChromium Nitride (CrN)
Purity99.5% ~ 99.9%
ShapePowder/ Granule/ Custom-made

TFM is renowned for its excellence in manufacturing and supplying high-purity Chromium Nitride evaporation materials, along with an extensive range of other evaporation materials. We provide these materials in both powder and granule forms, and we also offer customization options to meet specific needs. Whether you require standard or tailored solutions, TFM delivers quality and reliability in every product.

MSDS File

Chromium Nitride Evaporation Materials Overview

Chromium Nitride (CrN) evaporation materials from TFM are high-purity nitride ceramic compounds essential for achieving superior film quality in deposition processes. With a chemical formula of CrN, these materials are critical in ensuring the integrity of deposited films, thanks to their exceptional purity levels.

Key Specifications

Material TypeChromium Nitride
SymbolCrN
Appearance/ColorBlack solid
Melting Point1770 ˚C (decomposes)
Density5.9 g/cm3
Purity99.5% ~ 99.9%
ShapePowder/ Granule/ Custom-made

Applications

Chromium Nitride evaporation materials are versatile and utilized in various applications:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Ideal for wear protection, decorative coatings, and display technologies.

Packaging

TFM ensures that Chromium Nitride evaporation materials are meticulously tagged and labeled for easy identification and quality control. We take special care to prevent damage during storage and transportation.

Contact Us

TFM is a premier provider of high-purity Chromium Nitride evaporation materials, available in various shapes including tablets, granules, rods, and wires. Custom forms and quantities can be requested. Additionally, we offer a range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and further inquiries about our materials, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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