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chromiumii-silicide

VD0799 Chromium(II) Silicide Evaporation Materials, CrSi2

Catalog No.VD0799
MaterialChromium Silicide (CrSi2)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity chromium(II) silicide evaporation materials, as well as a diverse range of other evaporation materials. We provide our chromium(II) silicide in both powder and granule forms to meet various application needs. For specialized requirements, we also offer customized forms upon request.

MSDS File

Chromium(II) Silicide Evaporation Materials Description

Chromium(II) silicide (CrSi2) evaporation material from TFM is a high-purity silicide ceramic used in advanced deposition processes. Known for its chemical stability and performance, CrSi2 plays a crucial role in producing high-quality deposited films. TFM excels in delivering chromium(II) silicide with purity levels up to 99.9995%, ensuring reliability and superior quality through stringent quality assurance practices.

Specifications

Material TypeChromium disilicide
SymbolCrSi2
Appearance/ColorWhite solid
Melting Point1,490 °C (2,710 °F; 1,760 K)
Density4.91 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications

Chromium disilicide evaporation materials are widely used in:

  • Semiconductor Deposition
  • Chemical Vapor Deposition (CVD)
  • Physical Vapor Deposition (PVD)

These materials are especially useful in optics applications such as wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

Our chromium(II) silicide materials are meticulously tagged and labeled for clear identification and effective quality control. We take great care to prevent damage during storage and transportation to ensure the materials arrive in excellent condition.

Contact Us

TFM is a leading provider of high-purity chromium(II) silicide evaporation materials, available in various forms including tablets, granules, rods, and wires. Customized shapes and quantities are also offered to meet specific needs. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or inquiries about other materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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