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ST1011 Chromium Silicide Sputtering Target, Cr3Si

Chemical FormulaCr3Si
Catalog No.ST1011
CAS Number12018-36-9
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Chromium Silicide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Chromium Silicide Sputtering Target Description

Chromium Silicide Sputtering Targets are essential materials for thin film deposition in various applications. Comprising chromium (Cr) and silicon (Si), these targets offer unique properties crucial for both electronic and optical uses. They enable the deposition of thin films with high electrical conductivity, thermal stability, and corrosion resistance. Chromium Silicide films are widely used in semiconductor manufacturing, solar cells, sensors, and magnetic storage devices. By providing precise control over film thickness and composition, Chromium Silicide Sputtering Targets support the creation of advanced electronic and optoelectronic components across numerous industrial and research applications.

Related Product: Chromium Sputtering Target, Chromium Cobalt Sputtering Target

Chromium Silicide Sputtering Target Specifications

Compound FormulaCr3Si
Molecular Weight184.07
AppearanceSilver Grey Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Chromium Silicide Sputtering Target Handling Notes

Indium bonding is advised for Chromium Silicide Sputtering Targets due to their characteristics that are not well-suited for traditional sputtering methods, such as brittleness and low thermal conductivity. This material’s low thermal conductivity and susceptibility to thermal shock make indium bonding a practical choice to ensure reliable and effective sputtering processes.

Chromium Silicide Sputtering Target Application

Chromium Silicide (Cr₃Si) Sputtering Targets serve a range of critical applications in thin film deposition, each benefiting from the material’s unique properties:

  • Semiconductor Manufacturing: Cr₃Si thin films are integral to semiconductor fabrication, used in creating transistors, diodes, and integrated circuits. Their high electrical conductivity and thermal stability enhance the performance and reliability of semiconductor devices.
  • Solar Cells: In photovoltaic technology, Cr₃Si thin films improve the efficiency and durability of solar cells. These films play a key role in capturing and converting solar energy into electricity, contributing to the overall performance of solar energy systems.
  • Magnetic Storage Devices: Chromium Silicide is utilized in the production of magnetic storage devices, including hard disk drives (HDDs) and magnetic tapes. The thin films act as recording media or magnetic layers, facilitating data storage and retrieval.
  • Sensors: Cr₃Si thin films are employed in sensors that monitor environmental factors such as temperature, pressure, and gas concentrations. These sensors are essential in automotive, aerospace, and industrial applications for accurate measurement and control.
  • Corrosion Protection: Coatings made from Cr₃Si offer exceptional resistance to oxidation, moisture, and chemical corrosion. These protective layers extend the lifespan of metallic surfaces exposed to harsh conditions.
  • Optical Applications: In optical coatings, Cr₃Si thin films enhance the performance of components such as lenses, mirrors, and filters. These coatings improve durability, reflectivity, and anti-reflective properties, benefiting various optical systems and devices.
  • Research and Development: Cr₃Si Sputtering Targets are used in research laboratories for thin film deposition studies and material characterization. Researchers use these targets to explore and develop new technologies and to better understand the material’s behavior in diverse environments.

Chromium Silicide Sputtering Target Packaging

Our Chromium Silicide Sputtering Target is meticulously managed during storage and transportation to maintain its quality and integrity in its original condition.

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TFM offers Chromium Silicide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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