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VD0609 Chromium Titanium Evaporation Materials, Cr/Ti

Catalog No.VD0609
MaterialChromium Titanium (Cr/Ti)
Purity99.9% ~ 99.995%
ShapePowder/ Granule/ Custom-made

TFM provides premium chromium-titanium evaporation materials, known for their high purity and reliability. We are a leading manufacturer and supplier, offering a wide range of evaporation materials tailored to meet various needs. Our chromium-titanium products are available in powder, granule, and custom forms upon request, ensuring flexibility and precision for your specific applications.

MSDS File

Chromium Titanium Evaporation Materials Description

TFM supplies Chromium Titanium (Cr/Ti) evaporation materials, a high-performance binary alloy used in physical vapor deposition (PVD) for producing durable, conductive, and corrosion-resistant thin films. The combination of chromium’s hardness and adhesion properties with titanium’s lightweight, stable oxide formation makes this alloy ideal for demanding thin film systems.

Cr/Ti thin films are valued in applications requiring:

  • High mechanical strength and wear resistance

  • Stable adhesion to oxides, nitrides, and metals

  • Controlled electrical conductivity

  • Corrosion-resistant barrier layers

  • High-temperature durability in vacuum conditions

This material is widely used in microelectronics, optical coatings, MEMS, and decorative/functional surface finishes.

Chromium Titanium Evaporation Material Specification

PropertyValue
Chemical FormulaCr/Ti Alloy (common ratios: 80:20, 50:50, 20:80)
Purity≥ 99.95% (3N5) metals basis
FormPellets, tablets, chunks, or custom-shaped pieces
AppearanceMetallic gray, dense solid
Melting Point~1450–1600 °C (composition-dependent)
Density~5.5–6.8 g/cm³
Evaporation MethodElectron beam (e-beam) or thermal evaporation
Particle SizeTypically 1–10 mm or per custom request
PackagingVacuum-sealed under inert gas or argon-filled ampoules

Custom alloy compositions and geometries are available upon request.

Applications of Chromium Titanium Evaporation Materials

  • Hard and decorative coatings for tools and watch components

  • Diffusion barriers and adhesion layers in semiconductors

  • Optical interference and reflective coatings

  • Conductive thin films for flexible electronics

  • Multilayer systems in advanced display and photovoltaic devices

Handling and Storage

  • Store in a cool, dry environment, sealed from air and moisture.

  • Use non-metallic tweezers and gloves to prevent surface contamination.

  • Minimize thermal shock when placing in crucibles to prevent cracking.

Packaging

TFM carefully packages Chromium Titanium evaporation materials in anti-static containers, vacuum-sealed or backfilled with inert gas to maintain purity and prevent oxidation. Each shipment includes labeling with composition, purity, and batch number for full traceability.

Get Contact

TFM is your trusted source for Chromium Titanium evaporation materials, offering customized compositions and shapes tailored to your vacuum coating systems.
Contact us today for technical consultation or to request a quote.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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