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VD0612 Cobalt Chromium Evaporation Materials, Co/Cr

Catalog No.VD0612
MaterialCobalt Chromium (Co/Cr)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM specializes in producing high-purity cobalt-chromium evaporation materials, ensuring exceptional reliability through rigorous quality assurance processes. We offer these materials in various forms, including tablets, granules, pellets, and powder, to suit diverse application requirements.

MSDS File

High-Purity Cobalt-Chromium Evaporation Materials

Cobalt-chromium evaporation materials are essential for achieving high-quality deposited films in various deposition processes. TFM produces these materials with exceptional purity, up to 99.9995%, supported by stringent quality assurance processes to ensure their reliability.

Cobalt Chromium Evaporation Materials Applications

These materials are used in:

  • Deposition Processes: Key for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Employed for wear protection, decorative coatings, and display technologies.

Product Packaging and Handling

Our cobalt-chromium evaporation materials are handled with care to prevent damage during storage and transportation, preserving their quality in their original condition.

Contact Us

As a leading manufacturer and supplier, TFM offers cobalt-chromium evaporation materials in various forms, including powder and granule, with custom options available upon request. For current pricing and inquiries about our evaporation materials and other deposition products, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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