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VD0613 Cobalt Iron Evaporation Materials, Co/Fe

Catalog No.VD0613
MaterialCobalt Iron (Co/Fe)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

At TFM, we are dedicated to delivering high-purity cobalt iron evaporation materials that meet rigorous quality standards. Our commitment to excellence ensures that every product is reliable and performs consistently. We offer a diverse range of forms, including tablets, granules, pellets, and powder, to suit various applications and needs. Our advanced quality assurance processes are in place to guarantee the integrity and performance of each material.

MSDS File
Cobalt Iron Evaporation Materials: Overview

TFM provides high-purity cobalt iron evaporation materials, which are crucial in various deposition processes. This alloy, composed of cobalt (Co) and iron (Fe), is essential for producing high-quality deposited films. We manufacture our cobalt iron materials with purity levels reaching up to 99.9995%, ensuring exceptional performance and reliability. Our stringent quality assurance processes confirm the consistency and integrity of each product.

Applications of Cobalt Iron Evaporation Materials

Our cobalt iron evaporation materials find extensive use in:

  • Deposition Processes: These materials are integral to semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD) techniques.
  • Optics: They are utilized in applications such as wear protection, decorative coatings, and display technologies.

Packaging and Handling

To maintain the highest quality, our cobalt iron evaporation materials are meticulously handled during storage and transportation. We take every precaution to avoid damage and preserve the materials in their optimal condition.

Contact Us

TFM is a premier manufacturer and supplier of high-purity cobalt iron evaporation materials, offering a variety of forms including powder and granules. Custom forms are available upon request. For current pricing or to inquire about other evaporation materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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