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Cobalt Iron Sputtering Target

ST0078 Cobalt Iron Sputtering Target, CoFe

Chemical Formula: Co/Fe
Catalog Number: ST0078
CAS Number: 12052-28-7
Purity: 99.9%, 99.95%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Cobalt Iron Sputtering Targets come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Cobalt Iron Sputtering Target (CoFe) is a high-performance magnetic alloy target widely used for depositing soft magnetic thin films in spintronics, magnetic sensors, memory devices, and advanced microelectronic components. With its high saturation magnetization and excellent magnetic permeability, CoFe thin films play a critical role in magnetic tunnel junctions (MTJs), read/write heads, and magnetic shielding layers.

Engineered for uniform sputtering behavior and compositional stability, CoFe sputtering targets support both research-scale deposition and high-volume industrial production.

Detailed Description

Cobalt Iron (CoFe) is a binary ferromagnetic alloy typically formulated in controlled atomic or weight ratios such as Co₅₀Fe₅₀, Co₇₀Fe₃₀, or customized compositions. The alloy exhibits:

  • High saturation magnetization

  • Low coercivity (soft magnetic behavior)

  • Good thermal stability

  • Strong spin polarization

These properties make CoFe thin films particularly suitable for high-sensitivity magnetic and spin-dependent electronic applications.

CoFe sputtering targets are manufactured through vacuum melting and controlled alloying processes to ensure chemical homogeneity and dense microstructure. Hot isostatic pressing (HIP) or precision casting may be applied to improve density and reduce porosity, resulting in stable sputtering rates and minimized particle generation.

Targets are available in:

  • Planar round or rectangular geometries

  • Bonded configurations with copper backing plates (indium or elastomer bonding)

  • Unbonded forms for laboratory-scale deposition

Careful control of grain structure enhances sputtering uniformity and ensures consistent magnetic film performance.

Applications

Cobalt Iron Sputtering Target (CoFe) is widely used in:

  • Magnetic tunnel junction (MTJ) layers

  • Spintronic devices

  • MRAM (Magnetoresistive Random Access Memory)

  • GMR/TMR sensor fabrication

  • Magnetic recording heads

  • Soft magnetic thin films

  • Microwave and RF magnetic components

  • Magnetic shielding coatings

In spintronic structures, CoFe films are often combined with MgO or other insulating layers to form high-efficiency tunneling devices.

Technical Parameters

ParameterTypical Value / RangeImportance
CompositionCo₅₀Fe₅₀, Co₇₀Fe₃₀ (custom)Defines magnetic properties
Purity99.9% – 99.99% (metal basis)Reduces impurities in films
Density≥ 99% theoretical densityStable sputtering behavior
Diameter25 – 300 mm (custom)Matches sputtering cathodes
Thickness3 – 6 mm (custom)Influences target lifetime
BondingCopper backing (optional)Improves heat dissipation
Sputtering MethodDC / RF MagnetronProcess flexibility

Comparison with Related Materials

MaterialKey AdvantageTypical Application
CoFeHigh saturation magnetizationSpintronics & MTJ
CoFeBAmorphous structure, smooth interfacesAdvanced MTJ stacks
Pure CoStrong magnetic responseMagnetic films
Pure FeCost-effective magnetic layerBasic magnetic coatings

Compared with pure cobalt or iron, CoFe alloy offers optimized magnetic performance and improved film stability. Compared with CoFeB, it provides higher crystalline magnetic properties without boron-induced amorphization.

FAQ

QuestionAnswer
Can the Co/Fe ratio be customized?Yes, alloy composition can be tailored to meet specific magnetic performance requirements.
Is a copper backing plate necessary?For high-power sputtering, bonding to a copper backing plate is recommended for thermal management.
What sputtering methods are supported?Suitable for both DC and RF magnetron sputtering.
Can small R&D quantities be supplied?Yes, flexible quantities are available for laboratory research.
How is the target packaged?Vacuum-sealed packaging with protective cushioning ensures safe transport.

Packaging

Our Cobalt Iron Sputtering Target (CoFe) products are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. Each target is carefully protected to prevent surface damage and contamination during storage and transportation.

Conclusion

Cobalt Iron Sputtering Target (CoFe) provides a reliable and high-performance solution for depositing soft magnetic thin films in spintronics, memory devices, and magnetic sensing technologies. With customizable compositions, high density, and optional backing plate configurations, CoFe targets deliver consistent sputtering performance and magnetic film quality.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

CoFe Target 50:50 at% 3N5, ø50.8 × 3.18mm, CoFe Target 50:50 at% 3N5, ø50.8 × 6.35mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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