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VD0615 Cobalt Nickel Evaporation Materials, Co/Ni

Catalog No.VD0615
MaterialCobalt Nickel (Co/Ni)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM specializes in manufacturing high-purity cobalt nickel evaporation materials, ensuring exceptional product reliability through stringent quality assurance processes. Our materials are available in various forms, including tablets, granules, pellets, and powder, to meet diverse application needs.

MSDS File

Cobalt Nickel Evaporation Materials: Overview

TFM produces high-purity cobalt nickel evaporation materials, which consist of an alloy of cobalt (Co) and nickel (Ni). These materials are crucial for achieving high-quality deposited films in various applications. Our cobalt nickel evaporation materials are available with purity levels reaching up to 99.9995%, thanks to our rigorous quality assurance processes that ensure their reliability and performance.

Applications of Cobalt Nickel Evaporation Materials

Our cobalt nickel evaporation materials are utilized in:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Handling

To ensure the highest quality, our cobalt nickel evaporation materials are carefully handled during storage and transportation. This attention to detail helps prevent damage and preserves the materials in their best condition.

Contact Us

TFM is a leading provider of high-purity cobalt nickel evaporation materials. We offer these materials in powder and granule forms, with custom options available upon request. For up-to-date pricing or to inquire about other deposition materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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