Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
cobalt-titanium-coti-sputtering-target-removebg-preview

ST0081 Cobalt Titanium Sputtering Target, Co/Ti

Chemical Formula: Co/Ti
Catalog Number: ST0081
CAS Number: 7440-48-4 | 7440
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Cobalt Titanium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Cobalt Titanium Sputtering Target Description

The Cobalt Titanium sputtering target from TFM is a silvery alloy composed of cobalt (Co) and titanium (Ti). This high-quality sputtering material is designed for applications that require the combined properties of these two elements.

CobaltCobalt, symbolized as “Co,” is a chemical element named after the German word ‘kobald,’ meaning goblin. It was first mentioned in 1732 and observed by G. Brandt. Cobalt has an atomic number of 27 and is located in Period 4, Group 9 of the d-block in the periodic table. Its relative atomic mass is 58.933195(5) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Cobalt Sputtering Target

Titanium

Titanium, symbolized as “Ti,” is a chemical element named after the Titans, the sons of the Earth goddess in Greek mythology. It was first mentioned and observed by W. Gregor in 1791, and its isolation was later achieved and announced by J. Berzelius. Titanium has an atomic number of 22 and is located in Period 4, Group 4 of the d-block in the periodic table. Its relative atomic mass is 47.867(1) Daltons, with the number in brackets indicating the measurement uncertainty.

Related Product: Titanium Sputtering Target

Cobalt Titanium Sputtering Target Packaging

Our Cobalt Titanium sputtering targets are meticulously handled to prevent any damage during storage and transportation. This careful handling ensures that our products maintain their original quality and arrive in perfect condition.

Get Contact

TFM offers Cobalt Titanium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0081 Cobalt Titanium Sputtering Target, Co/Ti”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top