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VD0617 Cobalt Tungsten Evaporation Materials, Co/W

Catalog No.VD0617
MaterialCobalt Tungsten (Co/W)
Purity99.9% ~ 99.95%
ShapePowder/ Granule/ Custom-made

TFM is a leader in crafting high-purity cobalt tungsten evaporation materials, ensuring exceptional quality and reliability through rigorous quality assurance protocols. We offer these materials in various forms, including tablets, granules, pellets, and powder, tailored to meet diverse application needs.

MSDS File

Cobalt Tungsten Evaporation Materials Overview

TFM provides premium cobalt tungsten evaporation materials, an alloy composed of cobalt (Co) and tungsten (W). These high-purity materials, with purity levels reaching up to 99.9995%, are crucial for high-quality deposition processes. Our advanced quality assurance practices ensure that each batch meets stringent reliability standards.

Related Products: Cobalt Evaporation Materials, Tungsten Evaporation Materials

Applications of Cobalt Tungsten Evaporation Materials

Our cobalt tungsten evaporation materials are widely utilized in various applications, including:

  • Deposition Processes: Essential for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Uses: Ideal for wear protection, decorative coatings, and display technologies.

Packaging and Handling

To maintain the integrity of our cobalt tungsten evaporation materials, we implement meticulous handling procedures. This ensures that the materials remain undamaged during storage and transportation.

Contact Us

TFM is a top manufacturer and supplier of high-purity cobalt tungsten evaporation materials. We offer these materials in several forms, including powder and granules, with customized options available upon request. For pricing information and inquiries about our full range of evaporation materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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