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Copper Gallium Evaporation Materials

VD0621 Copper Gallium Evaporation Materials, Cu/Ga

Catalog No.VD0621
MaterialCopper Gallium (Cu/Ga)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

At TFM, we excel in crafting high-purity copper gallium evaporation materials. Our commitment to quality is reflected in our rigorous quality assurance processes, ensuring that every product meets the highest standards of reliability. We offer our copper gallium materials in a range of forms, including tablets, granules, pellets, and powders, to meet diverse application needs.

MSDS File

Copper Gallium Evaporation Materials Overview

TFM offers top-quality copper gallium evaporation materials, a specialized alloy combining copper (Cu) and gallium (Ga). These high-purity materials, reaching up to 99.9995% purity, are crucial for achieving exceptional deposition processes that ensure superior film quality. TFM’s rigorous quality assurance processes guarantee that our products deliver reliable performance in every application.

Applications of Copper Gallium Evaporation Materials

Copper gallium evaporation materials from TFM are versatile and essential in several high-tech applications, including:

  • Semiconductor Deposition: Ideal for both chemical vapor deposition (CVD) and physical vapor deposition (PVD) processes.
  • Optical Applications: Used in producing coatings for wear protection, decorative finishes, and display technologies.

Packaging and Handling

Our copper gallium evaporation materials are meticulously packaged to prevent any damage during storage and transportation, ensuring that they arrive in pristine condition, ready for use.

Related Products

Explore our related products, including Copper Evaporation Materials and Gallium Sputtering Targets, to complement your deposition needs.

Contact Us

TFM is a leading provider of high-purity copper gallium evaporation materials, available in various forms such as powders and granules. We also offer customized forms upon request. For pricing information or to inquire about other deposition materials not listed, please reach out to us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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